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Chemical mechanical planarization of films comprising elemental silicon
Grant 11,111,415 - Henry , et al. September 7, 2 | 2021-09-07 |
Composite particles, method of refining and use thereof
Grant 10,894,906 - Zhou , et al. January 19, 2 | 2021-01-19 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
Grant 10,669,449 - Zhou , et al. | 2020-06-02 |
Composite Abrasive Particles for Chemical Mechanical Planarization Composition and Method of Use Thereof
App 20200115590 - Zhou; Hongjun ; et al. | 2020-04-16 |
Chemical Mechanical Planarization Of Films Comprising Elemental Silicon
App 20200032108 - Henry; James Matthew ; et al. | 2020-01-30 |
Tungsten Chemical Mechanical Polishing For Reduced Oxide Erosion
App 20200024515 - Lu; Chun ; et al. | 2020-01-23 |
Composite Particles, Method of Refining And Use Thereof
App 20190359868 - Zhou; Hongjun ; et al. | 2019-11-28 |
Composite particles, method of refining and use thereof
Grant 10,421,890 - Zhou , et al. Sept | 2019-09-24 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
Grant 10,418,247 - Murella , et al. Sept | 2019-09-17 |
Composition and method used for chemical mechanical planarization of metals
Grant 10,373,842 - Chang , et al. | 2019-08-06 |
Additives for barrier chemical mechanical planarization
Grant 10,253,216 - Stender , et al. | 2019-04-09 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
Grant 10,109,493 - Zhou , et al. October 23, 2 | 2018-10-23 |
Chemical Mechanical Planarization of Films Comprising Elemental Silicon
App 20180244955 - Henry; James Matthew ; et al. | 2018-08-30 |
Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives
Grant 10,032,644 - Shi , et al. July 24, 2 | 2018-07-24 |
Additives for Barrier Chemical Mechanical Planarization
App 20180002571 - Stender; Matthias ; et al. | 2018-01-04 |
Composition and Method Used for Chemical Mechanical Planarization of Metals
App 20170372918 - Chang; Song Y. ; et al. | 2017-12-28 |
Composite Particles, Method of Refining and Use Thereof
App 20170283673 - Zhou; Hongjun ; et al. | 2017-10-05 |
Composite Abrasive Particles For Chemical Mechanical Planarization Composition And Method Of Use Thereof
App 20170133236 - Murella; Krishna P. ; et al. | 2017-05-11 |
Barrier Chemical Mechanical Planarization Slurries Using Ceria-Coated Silica Abrasives
App 20160358790 - Shi; Xiaobo ; et al. | 2016-12-08 |
Composite Abrasive Particles For Chemical Mechanical Planarization Composition and Method of Use Thereof
App 20160200944 - Zhou; Hongjun ; et al. | 2016-07-14 |
Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor
App 20160122590 - Lew; Blake J. ; et al. | 2016-05-05 |
Method for wafer dicing and composition useful thereof
Grant 9,328,318 - Tamboli , et al. May 3, 2 | 2016-05-03 |
Composition and Method Used for Chemical Mechanical Planarization of Metals
App 20160079084 - Chang; Song Y. ; et al. | 2016-03-17 |
Method for wafer dicing and composition useful thereof
Grant 8,883,701 - Tamboli , et al. November 11, 2 | 2014-11-11 |
Formulations and method for post-CMP cleaning
Grant 8,765,653 - Tamboli , et al. July 1, 2 | 2014-07-01 |
Method for Wafer Dicing and Composition Useful Thereof
App 20140170835 - Tamboli; Dnyanesh Chandrakant ; et al. | 2014-06-19 |
Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
Grant 8,580,656 - Collier , et al. November 12, 2 | 2013-11-12 |
Compositions and Methods for Texturing of Silicon Wafers
App 20130130508 - Wu; Aiping ; et al. | 2013-05-23 |
Compositions and Methods for Texturing of Silicon Wafers
App 20120295447 - Tamboli; Dnyanesh Chandrakant ; et al. | 2012-11-22 |
Method for Wafer Dicing and Composition Useful Thereof
App 20120009762 - Tamboli; Dnyanesh Chandrakant ; et al. | 2012-01-12 |
Method and composition for restoring dielectric properties of porous dielectric materials
Grant 7,977,121 - Tamboli , et al. July 12, 2 | 2011-07-12 |
Formulations And Method For Post-CMP Cleaning
App 20110136717 - Tamboli; Dnyanesh Chandrakant ; et al. | 2011-06-09 |
Process for Inhibiting Corrosion and Removing Contaminant from a Surface During Wafer Dicing and Composition Useful Therefor
App 20100009517 - Collier; Terence Quintin ; et al. | 2010-01-14 |
Method and Composition for Post-CMP Cleaning of Copper Interconnects Comprising Noble Metal Barrier Layers
App 20090291873 - Tamboli; Dnyanesh Chandrakant | 2009-11-26 |
Method and composition for restoring dielectric properties of porous dielectric materials
App 20080118995 - Tamboli; Dnyanesh Chandrakant ; et al. | 2008-05-22 |
Electrochemical method and system for monitoring hydrogen peroxide concentration in slurries
Grant 6,972,083 - Desai , et al. December 6, 2 | 2005-12-06 |
Alkaline post-chemical mechanical planarization cleaning compositions
App 20050205835 - Tamboli, Dnyanesh Chandrakant ; et al. | 2005-09-22 |
Electrochemical method and system for monitoring hydrogen peroxide concentration in slurries
App 20040069625 - Desai, Vimalkur Haribhai ; et al. | 2004-04-15 |
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