Tamba; Akihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tamba; Akihiro.The latest application filed is for "electrical apparatus, cooling system therefor, and electric vehicle".

Company Profile

0.21.14

Tamba; Akihiro - Hitachinaka JP
Tamba; Akihiro - Tokyo JP
Tamba, Akihiro - Hitachi-shi JP
Tamba; Akihiro - Hitachi JP
Tamba; Akihiro - Mito JP
Tamba; Akihiro - Ome JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical apparatus, cooling system therefor, and electric vehicle Grant 7,983,044 - Nakamura , et al. July 19, 2	2011-07-19
Power semiconductor module Grant 7,928,587 - Tamba , et al. April 19, 2	2011-04-19
Electrical Apparatus, Cooling System Therefor, And Electric Vehicle App 20100139997 - NAKAMURA; Takayoshi ; et al.	2010-06-10
Electrical apparatus, cooling system therefor, and electric vehicle Grant 7,660,122 - Nakamura , et al. February 9, 2	2010-02-09
Power Semiconductor Module App 20080258316 - Tamba; Akihiro ; et al.	2008-10-23
Electrical Apparatus, Cooling System Therefor, And Electric Vehicle App 20070242435 - NAKAMURA; Takayoshi ; et al.	2007-10-18
Electrical apparatus, cooling system therefor, and electric vehicle Grant 7,252,167 - Nakamura , et al. August 7, 2	2007-08-07
Electrical apparatus, cooling system therefor, and electric vehicle App 20060243504 - Nakamura; Takayoshi ; et al.	2006-11-02
Electrical apparatus, cooling system therefor, and electric vehicle Grant 7,090,044 - Nakamura , et al. August 15, 2	2006-08-15
Electrical apparatus, cooling system therefor, and electric vehicle Grant 6,978,856 - Nakamura , et al. December 27, 2	2005-12-27
Electrical apparatus, cooling system therefor, and electric vehicle App 20040173392 - Nakamura, Takayoshi ; et al.	2004-09-09
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer Grant 6,784,538 - Nakamura , et al. August 31, 2	2004-08-31
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer Grant 6,768,193 - Nakamura , et al. July 27, 2	2004-07-27
Electrical apparatus, cooling system therefor, and electric vehicle App 20040020231 - Nakamura, Takayoshi ; et al.	2004-02-05
Water cooled inverter Grant 6,661,659 - Tamba , et al. December 9, 2	2003-12-09
Water cooled inverter Grant 6,621,701 - Tamba , et al. September 16, 2	2003-09-16
Liquid cooled circuit device Grant 6,594,149 - Yamada , et al. July 15, 2	2003-07-15
Liquid cooled circuit device and a manufacturing method thereof Grant 6,588,647 - Yamada , et al. July 8, 2	2003-07-08
Water cooled inverter App 20030067748 - Tamba, Akihiro ; et al.	2003-04-10
Water cooled inverter App 20030067749 - Tamba, Akihiro ; et al.	2003-04-10
Liquid cooled circuit device and a manufacturing method thereof App 20030053298 - Yamada, Kazuji ; et al.	2003-03-20
Liquid cooled circuit device and a manufacturing method thereof App 20030053294 - Yamada, Kazuji ; et al.	2003-03-20
Heat transfer structure and a semi-conductor device App 20030025196 - Nakamura, Takayoshi ; et al.	2003-02-06
Heat transfer structure and a semi-conductor device App 20030025195 - Nakamura, Takayoshi ; et al.	2003-02-06
Power semiconductor module App 20020153532 - Sonobe, Yukio ; et al.	2002-10-24
Power semiconductor module App 20010038143 - Sonobe, Yukio ; et al.	2001-11-08
Power semiconductor module and motor drive system Grant 6,313,598 - Tamba , et al. November 6, 2	2001-11-06
Semiconductor device including an integrally molded lead frame Grant 6,291,880 - Ogawa , et al. September 18, 2	2001-09-18
Semiconductor module, power converter using the same and manufacturing method thereof Grant 6,144,571 - Sasaki , et al. November 7, 2	2000-11-07
Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability Grant 5,920,119 - Tamba , et al. July 6, 1	1999-07-06
High-speed semiconductor memory device and data processing system using the same Grant 5,654,931 - Tamba , et al. August 5, 1	1997-08-05
High-speed semiconductor integrated circuit device composed of CMOS and bipolar transistors Grant 5,614,848 - Kaminaga , et al. March 25, 1	1997-03-25
Semiconductor integrated circuit device Grant 5,604,417 - Kaminaga , et al. February 18, 1	1997-02-18
Monolithic semiconductor IC device including blocks having different functions with different breakdown voltages Grant 5,121,185 - Tamba , et al. June 9, 1	1992-06-09
Semiconductor integrated circuit device Grant 5,081,515 - Murata , et al. January 14, 1	1992-01-14

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