loadpatents
Patent applications and USPTO patent grants for Tamai; Shoji.The latest application filed is for "binder for fuel cell, composition for forming electrode, electrode, and fuel cell using the electrode".
Patent | Date |
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Binder for fuel cell, composition for forming electrode, electrode, and fuel cell using the electrode Grant 8,288,058 - Toriida , et al. October 16, 2 | 2012-10-16 |
Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin Grant 7,345,135 - Ishikawa , et al. March 18, 2 | 2008-03-18 |
Binder for Fuel Cell, Composition for Forming Electrode, Electrode, and Fuel Cell Using the Electrode App 20070292733 - Toriida; Masahiro ;   et al. | 2007-12-20 |
Polyether ketone and method of producing the same Grant 7,217,780 - Toriida , et al. May 15, 2 | 2007-05-15 |
Fuel cell and method for producing same App 20060251951 - Obata; Takeshi ;   et al. | 2006-11-09 |
Magnetic core and magnetic core-use adhesive resin composition Grant 6,917,275 - Ono , et al. July 12, 2 | 2005-07-12 |
Process for producing polyimide Grant 6,916,898 - Kuroki , et al. July 12, 2 | 2005-07-12 |
Polyether ketone and method for production thereof App 20050085597 - Toriida, Masahiro ;   et al. | 2005-04-21 |
Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin App 20040191602 - Ishikawa, Junichi ;   et al. | 2004-09-30 |
Magnetic core and magnetic core-use adhesive resin composition App 20040137247 - Ono, Takashi ;   et al. | 2004-07-15 |
Process for producing polyimide App 20030158370 - Kuroki, Takashi ;   et al. | 2003-08-21 |
Polyimides and polyamic acids Grant 6,599,675 - Kamada , et al. July 29, 2 | 2003-07-29 |
Optical members made of polymide resins App 20030064235 - Okawa, Yuichi ;   et al. | 2003-04-03 |
Polyimides and polyamic acids App 20020182536 - Kamada, Jun ;   et al. | 2002-12-05 |
Crystalline polyimide for melt molding with satisfactory thermal stability Grant 6,458,912 - Kuroki , et al. October 1, 2 | 2002-10-01 |
Process for preparing polycondensation polymer compound Grant 5,719,256 - Tamai , et al. February 17, 1 | 1998-02-17 |
Polyimide resin composition Grant 5,494,996 - Tamai , et al. February 27, 1 | 1996-02-27 |
Heat-resistant adhesive Grant 5,346,982 - Tamai , et al. September 13, 1 | 1994-09-13 |
Polyimide and process for the preparation thereof Grant 5,260,388 - Tamai , et al. November 9, 1 | 1993-11-09 |
Heat-resistant adhesive and method of adhesion by using adhesive Grant 5,252,700 - Okikawa , et al. October 12, 1 | 1993-10-12 |
Preparation process of polyimide Grant 5,210,174 - Tamai , et al. May 11, 1 | 1993-05-11 |
Polymide Grant 5,196,506 - Tamai , et al. March 23, 1 | 1993-03-23 |
Thermosetting resin from penta arylene bis maleimide Grant 5,106,937 - Yamaya , et al. April 21, 1 | 1992-04-21 |
Polyimide/polyamideimide resin composition Grant 4,987,197 - Ohta , et al. January 22, 1 | 1991-01-22 |
Polyimide and high-temperature adhesive thereof Grant 4,931,531 - Tamai , et al. June 5, 1 | 1990-06-05 |
Polyimide Grant 4,908,409 - Oikawa , et al. March 13, 1 | 1990-03-13 |
Flexible copper-clad circuit substrate Grant 4,883,718 - Ohta , et al. November 28, 1 | 1989-11-28 |
Flexible laminate printed-circuit board and methods of making same Grant 4,839,232 - Morita , et al. June 13, 1 | 1989-06-13 |
High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine Grant 4,797,466 - Oikawa , et al. January 10, 1 | 1989-01-10 |
High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane Grant 4,795,798 - Tamai , et al. January 3, 1 | 1989-01-03 |
Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide Grant 4,734,482 - Tamai , et al. March 29, 1 | 1988-03-29 |
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