loadpatents
name:-0.0097110271453857
name:-0.024029970169067
name:-0.00048398971557617
Tamai; Shoji Patent Filings

Tamai; Shoji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tamai; Shoji.The latest application filed is for "binder for fuel cell, composition for forming electrode, electrode, and fuel cell using the electrode".

Company Profile
0.23.8
  • Tamai; Shoji - Chiba JP
  • Tamai; Shoji - Sodegaura JP
  • Tamai; Shoji - Chiba-shi JP
  • Tamai, Shoji - Sodegaura-shi JP
  • Tamai; Shoji - Kanagawa JP
  • Tamai; Shoji - Fukuoka-ken JP
  • Tamai; Shoji - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Binder for fuel cell, composition for forming electrode, electrode, and fuel cell using the electrode
Grant 8,288,058 - Toriida , et al. October 16, 2
2012-10-16
Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin
Grant 7,345,135 - Ishikawa , et al. March 18, 2
2008-03-18
Binder for Fuel Cell, Composition for Forming Electrode, Electrode, and Fuel Cell Using the Electrode
App 20070292733 - Toriida; Masahiro ;   et al.
2007-12-20
Polyether ketone and method of producing the same
Grant 7,217,780 - Toriida , et al. May 15, 2
2007-05-15
Fuel cell and method for producing same
App 20060251951 - Obata; Takeshi ;   et al.
2006-11-09
Magnetic core and magnetic core-use adhesive resin composition
Grant 6,917,275 - Ono , et al. July 12, 2
2005-07-12
Process for producing polyimide
Grant 6,916,898 - Kuroki , et al. July 12, 2
2005-07-12
Polyether ketone and method for production thereof
App 20050085597 - Toriida, Masahiro ;   et al.
2005-04-21
Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin
App 20040191602 - Ishikawa, Junichi ;   et al.
2004-09-30
Magnetic core and magnetic core-use adhesive resin composition
App 20040137247 - Ono, Takashi ;   et al.
2004-07-15
Process for producing polyimide
App 20030158370 - Kuroki, Takashi ;   et al.
2003-08-21
Polyimides and polyamic acids
Grant 6,599,675 - Kamada , et al. July 29, 2
2003-07-29
Optical members made of polymide resins
App 20030064235 - Okawa, Yuichi ;   et al.
2003-04-03
Polyimides and polyamic acids
App 20020182536 - Kamada, Jun ;   et al.
2002-12-05
Crystalline polyimide for melt molding with satisfactory thermal stability
Grant 6,458,912 - Kuroki , et al. October 1, 2
2002-10-01
Process for preparing polycondensation polymer compound
Grant 5,719,256 - Tamai , et al. February 17, 1
1998-02-17
Polyimide resin composition
Grant 5,494,996 - Tamai , et al. February 27, 1
1996-02-27
Heat-resistant adhesive
Grant 5,346,982 - Tamai , et al. September 13, 1
1994-09-13
Polyimide and process for the preparation thereof
Grant 5,260,388 - Tamai , et al. November 9, 1
1993-11-09
Heat-resistant adhesive and method of adhesion by using adhesive
Grant 5,252,700 - Okikawa , et al. October 12, 1
1993-10-12
Preparation process of polyimide
Grant 5,210,174 - Tamai , et al. May 11, 1
1993-05-11
Polymide
Grant 5,196,506 - Tamai , et al. March 23, 1
1993-03-23
Thermosetting resin from penta arylene bis maleimide
Grant 5,106,937 - Yamaya , et al. April 21, 1
1992-04-21
Polyimide/polyamideimide resin composition
Grant 4,987,197 - Ohta , et al. January 22, 1
1991-01-22
Polyimide and high-temperature adhesive thereof
Grant 4,931,531 - Tamai , et al. June 5, 1
1990-06-05
Polyimide
Grant 4,908,409 - Oikawa , et al. March 13, 1
1990-03-13
Flexible copper-clad circuit substrate
Grant 4,883,718 - Ohta , et al. November 28, 1
1989-11-28
Flexible laminate printed-circuit board and methods of making same
Grant 4,839,232 - Morita , et al. June 13, 1
1989-06-13
High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine
Grant 4,797,466 - Oikawa , et al. January 10, 1
1989-01-10
High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane
Grant 4,795,798 - Tamai , et al. January 3, 1
1989-01-03
Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide
Grant 4,734,482 - Tamai , et al. March 29, 1
1988-03-29

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