Tamadate; Yuka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tamadate; Yuka.The latest application filed is for "wiring substrate and semiconductor device".
- Tamadate; Yuka - Nagano N/A JP
- Tamadate; Yuka - Nagano-shi JP
| Patent | Date |
|---|---|
| Wiring substrate and semiconductor device Grant 8,693,211 - Tamadate April 8, 2 | 2014-04-08 |
| Wiring Substrate And Semiconductor Device App 20120120624 - Tamadate; Yuka | 2012-05-17 |
| Semiconductor package and trenched semiconductor power device using the same Grant 7,825,499 - Tamadate November 2, 2 | 2010-11-02 |
| Wiring Substrate And Semiconductor Device App 20090154128 - Tamadate; Yuka | 2009-06-18 |
| Semiconductor Package And Semiconductor Device Using The Same App 20090001606 - Tamadate; Yuka | 2009-01-01 |
| Method for manufacturing wiring board and semiconductor device Grant 7,160,796 - Tamadate January 9, 2 | 2007-01-09 |
| Method for manufacturing wiring board and semiconductor device App 20050206009 - Tamadate, Yuka | 2005-09-22 |
| Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate App 20010054757 - Kurihara, Takashi ; et al. | 2001-12-27 |
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