Takubo; Chiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takubo; Chiaki.The latest application filed is for "semiconductor device".

Company Profile

0.58.50

Takubo; Chiaki - Sumida Tokyo JP
Takubo; Chiaki - Tokyo JP
Takubo; Chiaki - Sumida-ku N/A JP
Takubo; Chiaki - Tokyo-to JP
Takubo; Chiaki - Yokohama JP
Takubo; Chiaki - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 10,424,542 - Mori , et al. Sept	2019-09-24
Semiconductor Device App 20180096944 - Mori; Kentaro ; et al.	2018-04-05
Semiconductor device Grant 9,852,995 - Mori , et al. December 26, 2	2017-12-26
Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching Grant 9,633,902 - Matsui , et al. April 25, 2	2017-04-25
Method For Manufacturing Semiconductor Device App 20160268164 - MATSUI; Satoshi ; et al.	2016-09-15
Method For Manufacturing Semiconductor Device App 20160268165 - MATSUI; Satoshi ; et al.	2016-09-15
Light Emitting Device And Manufacturing Method Thereof App 20160079500 - AOKI; Hideo ; et al.	2016-03-17
Semiconductor module Grant 9,202,768 - Aoki , et al. December 1, 2	2015-12-01
Semiconductor module Grant 9,142,477 - Aoki , et al. September 22, 2	2015-09-22
Semiconductor Module App 20140252649 - AOKI; Hideo ; et al.	2014-09-11
Semiconductor Module App 20140252588 - AOKI; Hideo ; et al.	2014-09-11
Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module Grant 8,426,977 - Tanida , et al. April 23, 2	2013-04-23
Semiconductor device and method for manufacturing the same Grant 8,338,904 - Tanida , et al. December 25, 2	2012-12-25
Semiconductor manufacturing apparatus and semiconductor manufacturing method Grant 8,309,430 - Tanida , et al. November 13, 2	2012-11-13
Semiconductor device, through hole having expansion portion and thin insulating film Grant 8,237,285 - Tanida , et al. August 7, 2	2012-08-07
Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit Grant 8,220,147 - Yamaguchi , et al. July 17, 2	2012-07-17
Semiconductor Manufacturing Apparatus And Semiconductor Manufacturing Method App 20110217795 - TANIDA; Kazumasa ; et al.	2011-09-08
Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit Grant 7,939,171 - Aoki , et al. May 10, 2	2011-05-10
Semiconductor device and manufacturing method therefor Grant 7,932,605 - Imoto , et al. April 26, 2	2011-04-26
Semiconductor Device And Method For Manufacturing The Same App 20110073983 - Tanida; Kazumasa ; et al.	2011-03-31
Solid state imaging device and method for manufacturing same, and solid state imaging module Grant 7,888,760 - Sugiyama , et al. February 15, 2	2011-02-15
Method of manufacturing an electronic circuit formed on a substrate Grant 7,877,871 - Aoki , et al. February 1, 2	2011-02-01
Semiconductor Apparatus, Manufacturing Method Of Semiconductor Apparatus, And Camera Module App 20100038741 - Tanida; Kazumasa ; et al.	2010-02-18
Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20100025860 - Tanida; Kazumasa ; et al.	2010-02-04
Metal-containing Resin Particle, Resin Particle, Electronic Circuit Substrate, And Method Of Producing Electronic Circuit App 20100000083 - Yamaguchi; Naoko ; et al.	2010-01-07
Semiconductor device package having a semiconductor element with a roughened surface Grant 7,608,911 - Imoto , et al. October 27, 2	2009-10-27
Semiconductor device having power semiconductor elements Grant 7,531,876 - Omura , et al. May 12, 2	2009-05-12
Solid State Imaging Device And Method For Manufacturing Same, And Solid State Imaging Module App 20090096051 - SUGIYAMA; Hitoshi ; et al.	2009-04-16
Method of producing electronic circuit, and electronic circuit substrate Grant 7,486,921 - Yamaguchi , et al. February 3, 2	2009-02-03
Image forming apparatus and method of manufacturing electronic circuit using the same App 20090007426 - Aoki; Hideo ; et al.	2009-01-08
Method of producing a wiring board Grant 7,469,941 - Aoki , et al. December 30, 2	2008-12-30
Semiconductor device and method of manufacturing the same App 20080265443 - Imoto; Takashi ; et al.	2008-10-30
Optical semiconductor module and semiconductor device including the same Grant 7,438,481 - Numata , et al. October 21, 2	2008-10-21
Image forming apparatus and method of manufacturing electronic circuit using the same Grant 7,433,637 - Aoki , et al. October 7, 2	2008-10-07
Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts Grant 7,414,417 - Yamaguchi , et al. August 19, 2	2008-08-19
Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface Grant 7,405,159 - Imoto , et al. July 29, 2	2008-07-29
Method for manufacturing optical coupling part and optical coupling part Grant 7,401,983 - Sakurai , et al. July 22, 2	2008-07-22
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part Grant 7,364,369 - Sakurai , et al. April 29, 2	2008-04-29
Semiconductor device and manufacturing method therefor Grant 7,352,052 - Imoto , et al. April 1, 2	2008-04-01
Semiconductor device and manufacturing method therefor App 20080017973 - Imoto; Takashi ; et al.	2008-01-24
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part App 20070212001 - Sakurai; Wataru ; et al.	2007-09-13
Semiconductor device and method of manufacturing the same App 20070196956 - Imoto; Takashi ; et al.	2007-08-23
Semiconductor device and manufacturing method thereof Grant 7,259,046 - Aoki , et al. August 21, 2	2007-08-21
Method for manufacturing optical coupling part and optical coupling part App 20070165986 - Sakurai; Wataru ; et al.	2007-07-19
Semiconductor device and fabrication method for the same Grant 7,235,425 - Numata , et al. June 26, 2	2007-06-26
Semiconductor device package having a semiconductor element with resin Grant 7,202,563 - Imoto , et al. April 10, 2	2007-04-10
Wiring board and production method of wiring board App 20070029107 - Aoki; Hideo ; et al.	2007-02-08
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method Grant 7,095,112 - Endo , et al. August 22, 2	2006-08-22
Semiconductor device and method of manufacturing the same Grant 7,071,576 - Nakayoshi , et al. July 4, 2	2006-07-04
Method of producing electronic circuit and electronic circuit Grant 7,067,398 - Aoki , et al. June 27, 2	2006-06-27
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device App 20060102290 - Harada; Susumu ; et al.	2006-05-18
Semiconductor device and method of manufacturing semiconductor device App 20060071271 - Omura; Ichiro ; et al.	2006-04-06
Semiconductor device and manufacturing method thereof App 20060055050 - Numata; Hideo ; et al.	2006-03-16
Semiconductor device App 20060055018 - Sekiguchi; Masahiro ; et al.	2006-03-16
LSI package with interface module, transmission line package, and ribbon optical transmission line App 20060050493 - Hamasaki; Hiroshi ; et al.	2006-03-09
Optical semiconductor module and semiconductor device including the same App 20060045434 - Numata; Hideo ; et al.	2006-03-02
LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device App 20060035510 - Numata; Hideo ; et al.	2006-02-16
Organic semiconductor element and manufacturing method thereof App 20050279996 - Takubo, Chiaki ; et al.	2005-12-22
Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit Grant 6,977,130 - Aoki , et al. December 20, 2	2005-12-20
Semiconductor device and manufacturing method therefor App 20050253247 - Imoto, Takashi ; et al.	2005-11-17
Image forming apparatus and method of manufacturing electronic circuit using the same App 20050227161 - Aoki, Hideo ; et al.	2005-10-13
Wiring board and production method of wiring board App 20050224253 - Aoki, Hideo ; et al.	2005-10-13
Method of producing electronic circuit and electronic circuit App 20050224931 - Aoki, Hideo ; et al.	2005-10-13
Toner for producing wiring board and method of producing wiring board using thereof App 20050227158 - Yamauchi, Toshiaki ; et al.	2005-10-13
Semiconductor device and method of manufacturing the same App 20050212145 - Imoto, Takashi ; et al.	2005-09-29
Semiconductor device and manufacturing method thereof App 20050199989 - Aoki, Hideo ; et al.	2005-09-15
Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit App 20050191511 - Aoki, Hideo ; et al.	2005-09-01
Semiconductor device and fabrication method for the same App 20050184373 - Numata, Hideo ; et al.	2005-08-25
Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit App 20050158527 - Yamaguchi, Naoko ; et al.	2005-07-21
Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component App 20050153249 - Yamaguchi, Naoko ; et al.	2005-07-14
Method of producing electronic circuit, and electronic circuit substrate App 20050153220 - Yamaguchi, Naoko ; et al.	2005-07-14
Wiring board and multilayer wiring board App 20050053772 - Aoki, Hideo ; et al.	2005-03-10
Laminated-chip semiconductor device Grant 6,861,738 - Oyama , et al. March 1, 2	2005-03-01
Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts App 20050024067 - Yamaguchi, Naoko ; et al.	2005-02-03
Semiconductor device and method of manufacturing the same App 20050006766 - Nakayoshi, Hideo ; et al.	2005-01-13
Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit App 20040197487 - Aoki, Hideo ; et al.	2004-10-07
Semiconductor device assembled into a chip size package App 20040183192 - Otsuka, Masashi ; et al.	2004-09-23
Stacked type semiconductor device Grant 6,717,251 - Matsuo , et al. April 6, 2	2004-04-06
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method App 20040056341 - Endo, Mitsuyoshi ; et al.	2004-03-25
Semiconductor device Grant 6,617,678 - Yamazaki , et al. September 9, 2	2003-09-09
Semiconductor device App 20020195698 - Yamazaki, Takashi ; et al.	2002-12-26
Laminated-chip semiconductor device App 20020180030 - Oyama, Katsuhiko ; et al.	2002-12-05
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board App 20020046880 - Takubo, Chiaki ; et al.	2002-04-25
Ball grid array type package for semiconductor device Grant 6,376,907 - Takano , et al. April 23, 2	2002-04-23
Stacked type semiconductor device App 20020036338 - Matsuo, Mie ; et al.	2002-03-28
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board Grant 6,329,610 - Takubo , et al. December 11, 2	2001-12-11
Multi-layer circuit board Grant 6,271,478 - Horiuchi , et al. August 7, 2	2001-08-07
Multi-layer circuit board App 20010009203 - Horiuchi, Michio ; et al.	2001-07-26
Multi-layer circuit board with particular pad spacing Grant 6,229,099 - Horiuchi , et al. May 8, 2	2001-05-08
Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon Grant 6,094,057 - Hiruta , et al. July 25, 2	2000-07-25
Semiconductor device using gold bumps and copper leads as bonding elements Grant 6,049,130 - Hosomi , et al. April 11, 2	2000-04-11
Tape carrier and assembly structure thereof Grant 5,825,081 - Hosomi , et al. October 20, 1	1998-10-20
Flip chip mounting type semiconductor device Grant 5,801,447 - Hirano , et al. September 1, 1	1998-09-01
Semiconductor device having a bump electrode connected to an inner lead Grant 5,773,888 - Hosomi , et al. June 30, 1	1998-06-30
Semiconductor device, method of fabricating the same and copper leads Grant 5,747,881 - Hosomi , et al. May 5, 1	1998-05-05
Display device having driving circuits at the periphery of a substrate Grant 5,712,493 - Mori , et al. January 27, 1	1998-01-27
Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics Grant 5,631,499 - Hosomi , et al. May 20, 1	1997-05-20
Semiconductor device and BGA package Grant 5,543,663 - Takubo August 6, 1	1996-08-06
Method of manufacturing a semiconductor device Grant 5,533,664 - Sasaki , et al. July 9, 1	1996-07-09
Semiconductor assembly having laminated semiconductor devices Grant 5,394,010 - Tazawa , et al. February 28, 1	1995-02-28
Semiconductor device using film carrier Grant 5,304,843 - Takubo , et al. April 19, 1	1994-04-19
IC packing device Grant 5,220,486 - Takubo , et al. June 15, 1	1993-06-15
IC package for high-speed semiconductor integrated circuit device Grant 5,162,896 - Takubo , et al. November 10, 1	1992-11-10
Semiconductor integrated circuit apparatus Grant 5,021,866 - Sudo , et al. June 4, 1	1991-06-04
IC packing device with impedance adjusting insulative layer Grant 4,991,001 - Takubo , et al. February 5, 1	1991-02-05
Semiconductor integrated circuit device particularly for high speed logic operations Grant 4,949,163 - Sudo , et al. August 14, 1	1990-08-14
Timing controller for high-speed digital integrated circuit Grant 4,926,451 - Yoshihara , et al. May 15, 1	1990-05-15

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