Takii; Shukichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takii; Shukichi.The latest application filed is for "method of fabricating heat dissipating board".
- Takii; Shukichi - Ayase N/A JP
- TAKII; Shukichi - Ayase-shi JP
- Takii, Shukichi - Nagano JP
| Patent | Date |
|---|---|
| Substrate manufacturing method Grant 9,380,711 - Takii , et al. June 28, 2 | 2016-06-28 |
| Method of fabricating heat dissipating board Grant 9,363,885 - Taneko , et al. June 7, 2 | 2016-06-07 |
| Method Of Fabricating Heat Dissipating Board App 20160143126 - TANEKO; Noriaki ; et al. | 2016-05-19 |
| Method of producing printed circuit board, and printed board produced by the method Grant 9,185,811 - Saito , et al. November 10, 2 | 2015-11-10 |
| Substrate Manufacturing Method App 20140224762 - Takii; Shukichi ; et al. | 2014-08-14 |
| Method Of Producing Printed Circuit Board, And Printed Board Produced By The Method App 20130043063 - Saito; Yoichi ; et al. | 2013-02-21 |
| Multi-layer circuit board and method for manufacturing same App 20040148766 - Noguchi, Jinichi ; et al. | 2004-08-05 |
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