Takiar; Hem P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takiar; Hem P..The latest application filed is for "overlapping die stacks for nand package architecture".

Company Profile

1.69.29

Takiar; Hem P. - Fremont CA
Takiar; Hem P. - Sunnyvale CA US
Takiar; Hem P - Fremont CA
Takiar; Hem P. - San Jose CA
Takiar; Hem P. - Glendale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Overlapping Die Stacks For Nand Package Architecture App 20220271007 - Tai; Enyong ; et al.	2022-08-25
Systems And Methods For Reducing The Size Of A Semiconductor Assembly App 20220208744 - Ng; Hong Wan ; et al.	2022-06-30
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer App 20220181307 - Boo; Kelvin Tam Aik ; et al.	2022-06-09
Overlapping die stacks for NAND package architecture Grant 11,309,281 - Tai , et al. April 19, 2	2022-04-19
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer Grant 11,282,811 - Boo , et al. March 22, 2	2022-03-22
Surface Mount Device Bonded To An Inner Layer Of A Multi-layer Substrate App 20220078915 - Boo; Kelvin Tan Aik ; et al.	2022-03-10
Overlapping Die Stacks For Nand Package Architecture App 20220068877 - Tai; Enyong ; et al.	2022-03-03
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer App 20210358888 - Boo; Kelvin Tan Aik ; et al.	2021-11-18
Method for efficiently producing removable peripheral cards Grant 8,354,749 - Takiar January 15, 2	2013-01-15
Memory card with two standard sets of contacts and a hinged contact covering mechanism Grant 7,822,883 - Miller , et al. October 26, 2	2010-10-26
Memory card with two standard sets of contacts and a contact covering mechanism Grant 7,554,813 - Miller , et al. June 30, 2	2009-06-30
Memory Cards Having Two Standard Sets Of Contacts And A Hinged Contact Covering Mechanism App 20090134228 - Miller; Robert C. ; et al.	2009-05-28
Memory Cards Having Two Standard Sets Of Contacts And A Hinged Contact Covering Mechanism App 20090132763 - Miller; Robert C. ; et al.	2009-05-21
Memory card with two standard sets of contacts and a hinged contact covering mechanism Grant 7,487,265 - Miller , et al. February 3, 2	2009-02-03
Memory card with and without enclosure Grant 7,416,132 - Takiar , et al. August 26, 2	2008-08-26
Memory Cards Having Two Standard Sets Of Contacts App 20080191033 - Cuellar; Edwin J. ; et al.	2008-08-14
Memory cards having two standard sets of contacts Grant 7,364,090 - Cuellar , et al. April 29, 2	2008-04-29
Memory card with two standard sets of contacts and a contact covering mechanism Grant 7,355,860 - Miller , et al. April 8, 2	2008-04-08
Memory Card With Two Standard Sets Of Contacts And A Contact Covering Mechanism App 20080064272 - Miller; Robert C. ; et al.	2008-03-13
Memory card with contacts, device connector, and a connector covering mechanism Grant 7,340,540 - Miller , et al. March 4, 2	2008-03-04
Peripheral Card With Hidden Test Pins App 20080049392 - Takiar; Hem P.	2008-02-28
Memory card with push-push connector Grant 7,336,498 - Takiar , et al. February 26, 2	2008-02-26
Memory card with integral covered second device connector for use with computing devices without a memory card slot Grant 7,310,692 - Miller , et al. December 18, 2	2007-12-18
Memory card with chamfer Grant 7,306,161 - Takiar , et al. December 11, 2	2007-12-11
Memory card with adapter Grant 7,306,160 - Takiar , et al. December 11, 2	2007-12-11
Memory card with raised portion Grant 7,307,848 - Takiar December 11, 2	2007-12-11
Packaged memory devices with various unique physical appearances Grant 7,303,127 - Brewer , et al. December 4, 2	2007-12-04
Integrated Circuit Package Having Stacked Integrated Circuits And Method Therefor App 20070218588 - Takiar; Hem P. ; et al.	2007-09-20
Wafer level chip scale package Grant 7,241,643 - Kelkar , et al. July 10, 2	2007-07-10
Memory card with a contact covering lid Grant D542,797 - Cuellar , et al. May 15, 2	2007-05-15
Memory card Grant D538,286 - Takiar , et al. March 13, 2	2007-03-13
Memory card Grant D537,081 - Takiar , et al. February 20, 2	2007-02-20
Memory Cards Having Two Standard Sets of Contacts App 20070032101 - Cuellar; Edwin J. ; et al.	2007-02-08
Memory card with two sets of contacts Grant D535,297 - Cuellar , et al. January 16, 2	2007-01-16
Memory cards having two standard sets of contacts Grant 7,152,801 - Cuellar , et al. December 26, 2	2006-12-26
Memory Card With Two Standard Sets of Contacts and a Contact Covering Mechanism App 20060282553 - Miller; Robert C. ; et al.	2006-12-14
Integrated circuit package having stacked integrated circuits and method therefor App 20060267173 - Takiar; Hem P. ; et al.	2006-11-30
Method for efficiently producing removable peripheral cards App 20060267165 - Takiar; Hem P.	2006-11-30
Combined memory card and carrier assembly Grant D532,788 - Cuellar , et al. November 28, 2	2006-11-28
Combined memory card and carrier assembly Grant D531,181 - Cuellar , et al. October 31, 2	2006-10-31
Method for efficiently producing removable peripheral cards Grant 7,094,633 - Takiar August 22, 2	2006-08-22
Memory card Grant D525,978 - Takiar , et al. August 1, 2	2006-08-01
Memory card Grant D525,623 - Takiar , et al. July 25, 2	2006-07-25
Memory card Grant D525,248 - Takiar July 18, 2	2006-07-18
Memory card Grant D523,435 - Takiar , et al. June 20, 2	2006-06-20
Memory card with two standard sets of contacts and a contact covering mechanism App 20060084287 - Miller; Robert C. ; et al.	2006-04-20
Memory card with two sets of contacts Grant D518,059 - Cuellar , et al. March 28, 2	2006-03-28
Memory card with two sets of contacts Grant D515,586 - Cuellar , et al. February 21, 2	2006-02-21
Memory card with two sets of contacts Grant D515,587 - Cuellar , et al. February 21, 2	2006-02-21
Packaged memory devices with various unique physical appearances App 20060022055 - Brewer; Wesley G. ; et al.	2006-02-02
Stackable integrated circuit package and method therefor Grant 6,984,881 - Takiar January 10, 2	2006-01-10
Memory cards having two standard sets of contacts App 20050230484 - Cuellar, Edwin J. ; et al.	2005-10-20
Memory card with two standard sets of contacts and a contact covering mechanism App 20050230483 - Miller, Robert C. ; et al.	2005-10-20
Memory card with chamfer App 20050148217 - Takiar, Hem P. ; et al.	2005-07-07
Wafer level chip scale package Grant 6,900,532 - Kelkar , et al. May 31, 2	2005-05-31
Chip scale package with compliant leads Grant 6,900,110 - Takiar , et al. May 31, 2	2005-05-31
Memory card with push-push connector App 20050111280 - Takiar, Hem P. ; et al.	2005-05-26
Memory card with adapter App 20050105360 - Takiar, Hem P. ; et al.	2005-05-19
Peripheral card with hidden test pins App 20050013106 - Takiar, Hem P.	2005-01-20
Memory card with and without enclosure App 20050011671 - Takiar, Hem P. ; et al.	2005-01-20
Memory card with raised portion App 20050014298 - Takiar, Hem P.	2005-01-20
Method for efficiently producing removable peripheral cards App 20040259291 - Takiar, Hem P.	2004-12-23
Stackable integrated circuit package and method therefor App 20040251523 - Takiar, Hem P.	2004-12-16
Chip scale package with compliant leads Grant 6,521,970 - Takiar , et al. February 18, 2	2003-02-18
Metal coated markings on integrated circuit devices Grant 6,448,632 - Takiar , et al. September 10, 2	2002-09-10
Connection assembly for reflective liquid crystal projection with branched PCB display Grant 6,384,890 - Takiar , et al. May 7, 2	2002-05-07
Chip scale package and method for manufacture thereof Grant 6,284,566 - Lee , et al. September 4, 2	2001-09-04
Method of packaging fuses App 20010015477 - Singh, Inderjit ; et al.	2001-08-23
Techniques for wafer level molding of underfill encapsulant Grant 6,245,595 - Nguyen , et al. June 12, 2	2001-06-12
Method and apparatus for forming a plastic chip on chip package module Grant 6,238,949 - Nguyen , et al. May 29, 2	2001-05-29
Method of making integrated circuit packages Grant 6,177,288 - Takiar January 23, 2	2001-01-23
Chip scale package and method for manufacture thereof Grant 6,140,708 - Lee , et al. October 31, 2	2000-10-31
Fusible seal for LCD devices and methods for making same Grant 6,122,033 - Mathew , et al. September 19, 2	2000-09-19
Low cost ball grid array device and method of manufacture thereof Grant 6,054,338 - Lee , et al. April 25, 2	2000-04-25
Method of making flip chip and BGA interconnections Grant 6,024,275 - Takiar February 15, 2	2000-02-15
Reflective liquid crystal display and connection assembly and method Grant 5,969,783 - Takiar , et al. October 19, 1	1999-10-19
Device and method for reducing thermal cycling in a semiconductor package Grant 5,901,043 - Lin , et al. May 4, 1	1999-05-04
Low cost ball grid array device and method of manufacture thereof Grant 5,783,866 - Lee , et al. July 21, 1	1998-07-21
Electronic assembly for connecting to an electronic system and method of manufacture thereof Grant 5,718,038 - Takiar , et al. February 17, 1	1998-02-17
Method of making removable computer peripheral cards having a solid one-piece housing Grant 5,715,594 - Patterson , et al. February 10, 1	1998-02-10
Component stacking in multi-chip semiconductor packages Grant 5,629,563 - Takiar , et al. May 13, 1	1997-05-13
Multichip integrated circuit module with crossed bonding wires Grant 5,625,235 - Takiar April 29, 1	1997-04-29
Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards Grant 5,617,297 - Lo , et al. April 1, 1	1997-04-01
Removable computer peripheral cards having a solid one-piece housing Grant 5,554,821 - Patterson , et al. September 10, 1	1996-09-10
Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module Grant 5,543,640 - Sutherland , et al. August 6, 1	1996-08-06
Electronic assembly for connecting to an electronic system and method of manufacture thereof Grant 5,530,622 - Takiar , et al. June 25, 1	1996-06-25
Electronic system circuit package directly supporting components on isolated subsegments Grant 5,504,370 - Lin , et al. April 2, 1	1996-04-02
Stacked multi-chip modules and method of manufacturing Grant 5,502,289 - Takiar , et al. March 26, 1	1996-03-26
Stacked multi-chip modules and method of manufacturing Grant 5,495,398 - Takiar , et al. February 27, 1	1996-02-27
Lead frame including an inductor or other such magnetic component Grant 5,428,245 - Lin , et al. June 27, 1	1995-06-27
Stacked multi-chip modules and method of manufacturing Grant 5,422,435 - Takiar , et al. June 6, 1	1995-06-06
Device and method for reducing thermal cycling in a semiconductor package Grant 5,339,216 - Lin , et al. August 16, 1	1994-08-16
Nickel plated tape Grant 4,810,620 - Takiar , et al. March 7, 1	1989-03-07
Bonding pad interconnection structure Grant 4,723,197 - Takiar , et al. February 2, 1	1988-02-02
Nickel plated copper tape Grant 4,707,418 - Takiar , et al. November 17, 1	1987-11-17
Molded semiconductor package having improved heat dissipation Grant 4,684,975 - Takiar , et al. August 4, 1	1987-08-04
Intergranular insulation type semiconductive ceramic and method of producing same Grant 4,367,265 - Yu , et al. January 4, 1	1983-01-04