Taki; Hirokazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Taki; Hirokazu.The latest application filed is for "circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate".
- Taki; Hirokazu - Osaka JP
- Taki; Hirokazu - Kamakura JP
- Taki; Hirokazu - Amagasaki JP
| Patent | Date |
|---|---|
| Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate Grant 6,245,599 - Goto , et al. June 12, 2 | 2001-06-12 |
| Text search system for locating on the basis of keyword matching and keyword relationship matching Grant 5,297,039 - Kanaegami , et al. March 22, 1 | 1994-03-22 |
| System of simultaneous translation into a plurality of languages with sentence forming capabilities Grant 4,654,798 - Taki , et al. March 31, 1 | 1987-03-31 |
| Control apparatus for running moving object Grant 4,554,498 - Fujiwara , et al. November 19, 1 | 1985-11-19 |
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