Taki; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Taki; Hideaki.The latest application filed is for "ultrasonic transducer and method of producing the same".

Company Profile

0.4.4

Taki; Hideaki - Ise JP
Taki; Hideaki - Nagoya JP
TAKI; Hideaki - Ise-shi JP
TAKI; Hideaki - Nagoya-shi JP
Taki; Hideaki - Osaka JP
Taki, Hideaki - Ibaraki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ultrasonic transducer which is either crimped or welded during assembly Grant 7,876,030 - Taki , et al. January 25, 2	2011-01-25
Ultrasonic transducer and ultrasonic apparatus having the same Grant 7,847,468 - Kimura , et al. December 7, 2	2010-12-07
Ultrasonic Transducer And Method Of Producing The Same App 20090066192 - TAKI; Hideaki ; et al.	2009-03-12
Ultrasonic Transducer And Ultrasonic Apparatus Having The Same App 20090015104 - KIMURA; Wataru ; et al.	2009-01-15
Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device Grant 7,034,404 - Harada , et al. April 25, 2	2006-04-25
Dielectric filter having increased bandwidth Grant 6,844,796 - Taki , et al. January 18, 2	2005-01-18
Dielectric filter having increased bandwidth App 20030184414 - Taki, Hideaki ; et al.	2003-10-02
Method for manufacturing flexible printed circuit and flexible printed circuit obtained in the method App 20030064147 - Fujii, Hirofumi ; et al.	2003-04-03

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