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name:-0.035845041275024
name:-0.024066209793091
Takezawa; Yoshitaka Patent Filings

Takezawa; Yoshitaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takezawa; Yoshitaka.The latest application filed is for "epoxy resin, epoxy resin composition, epoxy resin cured product and composite material".

Company Profile
21.33.74
  • Takezawa; Yoshitaka - Tokyo JP
  • TAKEZAWA; Yoshitaka - Chiyoda-ku Tokyo
  • Takezawa; Yoshitaka - Ibaraki JP
  • TAKEZAWA; Yoshitaka - Tsukuba-shi JP
  • Takezawa; Yoshitaka - Tsukuba JP
  • Takezawa; Yoshitaka - Hitachinaka JP
  • Takezawa; Yoshitaka - Ibaraki-shi JP
  • Takezawa; Yoshitaka - Hitachi JP
  • Takezawa; Yoshitaka - Hitachi-shi JP
  • Takezawa, Yoshitaka - Hitachinaka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
Grant 11,440,990 - Yoshida , et al. September 13, 2
2022-09-13
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
Grant 11,352,562 - Higashiuchi , et al. June 7, 2
2022-06-07
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product And Composite Material
App 20220162374 - KATAGI; Hideyuki ;   et al.
2022-05-26
Anisotropic Heat-conducting Resin Member And Heat-transmitting Substrate
App 20220089930 - TAKEZAWA; Yoshitaka ;   et al.
2022-03-24
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product And Composite Material
App 20220049046 - MARUYAMA; Naoki ;   et al.
2022-02-17
Epoxy Resin B-stage Film, Epoxy Resin Cured Film And Method Of Producing Epoxy Resin Cured Film
App 20220025107 - TANAKA; Shingo ;   et al.
2022-01-27
Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
Grant 11,208,525 - Katagi , et al. December 28, 2
2021-12-28
Heat Radiation Material, Method For Producing A Heat Radiation Material, Composition, And Heat-generating Element
App 20210351102 - ITO; Maki ;   et al.
2021-11-11
Device And Heat Radiation Method
App 20210345518 - TAKAHASHI; Maki ;   et al.
2021-11-04
Heat Radiation Material, Method For Producing Heat Radiation Material, Heat Radiation Material Kit, And Heat Generator
App 20210332281 - TAKAHASHI; Maki ;   et al.
2021-10-28
Epoxy resin composition, cured product and composite material
Grant 11,149,109 - Yoshida , et al. October 19, 2
2021-10-19
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
Grant 11,015,020 - Higashiuchi , et al. May 25, 2
2021-05-25
Resin Composition, Hydrogen Gas Barrier Material, Cured Product, Composite Material, And Structure
App 20210139693 - FUKUDA; Kazumasa ;   et al.
2021-05-13
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20210130537 - FUKUDA; Kazumasa ;   et al.
2021-05-06
Resin sheet and cured product of resin sheet
Grant 10,988,585 - Nishiyama , et al. April 27, 2
2021-04-27
Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product
Grant 10,941,241 - Tanaka , et al. March 9, 2
2021-03-09
Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
Grant 10,934,387 - Katagi , et al. March 2, 2
2021-03-02
Cured Epoxy Resin Material, Epoxy Resin Composition, Molded Article, And Composite Material
App 20210054133 - FUKUDA; Kazumasa ;   et al.
2021-02-25
Epoxy Polymer, Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-stage Sheet, Cured Product, C-stage Sheet, Metal Foil With Resin, Metal Substrate And Method For Manufacturing Epoxy Resin
App 20210054136 - KATAGI; Hideyuki ;   et al.
2021-02-25
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
Grant 10,920,010 - Maruyama , et al. February 16, 2
2021-02-16
Anisotropic Thermal Conductive Resin Member And Manufacturing Method Thereof
App 20200407617 - TAKEZAWA; Yoshitaka ;   et al.
2020-12-31
Anisotropic Thermal Conductive Resin Fiber, Anisotropic Thermal Conductive Resin Member, And Manufacturing Method Of These
App 20200407888 - TAKEZAWA; Yoshitaka
2020-12-31
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20200392282 - MARUYAMA; Naoki ;   et al.
2020-12-17
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product And Method Of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, And Vehicle
App 20200385512 - FUKUDA; Kazumasa ;   et al.
2020-12-10
Resin composition and method of producing laminate
Grant 10,851,200 - Kiguchi , et al. December 1, 2
2020-12-01
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product And Composite Material
App 20200325398 - HIGASHIUCHI; Tomoko ;   et al.
2020-10-15
Method Of Producing Laminate
App 20200324538 - NISHIYAMA; Tomoo ;   et al.
2020-10-15
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
Grant 10,800,872 - Maruyama , et al. October 13, 2
2020-10-13
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20200270447 - MARUYAMA; Naoki ;   et al.
2020-08-27
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20200262969 - HIGASHIUCHI; Tomoko ;   et al.
2020-08-20
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20200247943 - Kind Code
2020-08-06
Resin Sheet And Cured Product Of Resin Sheet
App 20200223994 - NISHIYAMA; Tomoo ;   et al.
2020-07-16
Complex Of Lamellar Inorganic Compound And Organic Compound And Method Of Producing Thereof, Delaminated Lamellar Inorganic Comp
App 20200216324 - SONG; Shihui ;   et al.
2020-07-09
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product And Composite Material
App 20200199287 - HIGASHIUCHI; Tomoko ;   et al.
2020-06-25
Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article
Grant 10,662,279 - Yoshida , et al.
2020-05-26
Circuit Board Production Method, Circuit Sheet And Circuit Board
App 20200163221 - NISHIYAMA; Tomoo ;   et al.
2020-05-21
Epoxy Resin Composition, Thermally-conductive Material Precursor, B-stage Sheet, Prepreg, Heat Dissipation Material, Laminate, M
App 20200140651 - TAKEZAWA; Yoshitaka ;   et al.
2020-05-07
Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and
Grant 10,597,485 - Tanaka , et al.
2020-03-24
Resin composition and method of producing laminate
Grant 10,590,232 - Kiguchi , et al.
2020-03-17
Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board
Grant 10,584,228 - Takezawa , et al.
2020-03-10
Resin Composition And Method Of Producing Laminate
App 20200071455 - KIGUCHI; Kazuya ;   et al.
2020-03-05
Epoxy Resin Composition, Cured Product And Composite Material
App 20200002464 - YOSHIDA; Yuka ;   et al.
2020-01-02
Production Methods For Glassy Liquid-crystalline Epoxy Resin And Glassy Liquid-crystalline Epoxy Resin Composition, Storage Meth
App 20190375885 - TANAKA; Shingo ;   et al.
2019-12-12
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20190338068 - MARUYAMA; Naoki ;   et al.
2019-11-07
Resin Composition And Method Of Producing Laminate
App 20190338069 - KIGUCHI; Kazuya ;   et al.
2019-11-07
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, And Composite Material
App 20190284332 - MARUYAMA; Naoki ;   et al.
2019-09-19
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-containing Epoxy Resin Composition, Resin Sheet, Cured Product, And Epoxy
App 20190256643 - KATAGI; Hideyuki ;   et al.
2019-08-22
Prepreg mica tape and coil using same
Grant 10,373,727 - Song , et al.
2019-08-06
Gas Barrier Material, Resin Composition, Gas Barrier Member, Cured Product, And Composite Material
App 20190225794 - FUKUDA; Kazumasa ;   et al.
2019-07-25
Coil For Rotating Electrical Machine, Method For Producing Coil For Rotating Electrical Machine, Mica Tape, Cured Product Of Mica Tape, And Insulating Material
App 20190115119 - Yamamoto; Takaya ;   et al.
2019-04-18
Epoxy Resin Molding Material, Molded Product, Molded Cured Product, And Method For Producing Molded Cured Product
App 20190055344 - TANAKA; Kenji ;   et al.
2019-02-21
Epoxy Resin Composition, Semi-cured Epoxy Resin Composition, Cured Epoxy Resin Composition, Molded Article, And Cured Molded Article
App 20190040183 - YOSHIDA; Yuka ;   et al.
2019-02-07
Phenolic resin composition
Grant 10,000,679 - Kosugi , et al. June 19, 2
2018-06-19
Epoxy Resin Composition, Thermally-conductive Material Precursor, B-stage Sheet, Prepreg, Heat Dissipation Material, Laminate, Metal Substrate, And Printed Circuit Board
App 20180163015 - TAKEZAWA; Yoshitaka ;   et al.
2018-06-14
Resin Composition, Resin Sheet, Prepreg, Insulator, Resin Sheet Cured Product, And Heat Dissipator
App 20180148622 - TAKEZAWA; Yoshitaka ;   et al.
2018-05-31
Coil For Rotary Electrical Machine, Method Of Producing Rotary Electrical Machine And Mica Tape
App 20180137956 - YAMAMOTO; Takaya ;   et al.
2018-05-17
Complex Of Lamellar Inorganic Compound And Organic Compound And Method Of Producing Thereof, Delaminated Lamellar Inorganic Compound And Method Of Producing Thereof, Insulating Resin Composition, Resin Sheet, Insulator, Resin Sheet Cured Product, And Heat Dissipating Member
App 20180044191 - SONG; Shihui ;   et al.
2018-02-15
Resin Composition, Resin Sheet, And Cured Resin Material And Method For Producing The Same
App 20180009979 - NISHIYAMA; Tomoo ;   et al.
2018-01-11
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-containing Epoxy Resin Composition, Resin Sheet, Cured Product, And Epoxy Compound
App 20170349695 - KATAGI; Hideyuki ;   et al.
2017-12-07
Prepreg Mica Tape And Coil Using Same
App 20160247595 - SONG; Shihui ;   et al.
2016-08-25
Composite particle, method for producing the same, and resin composition
Grant 9,249,293 - Takezawa , et al. February 2, 2
2016-02-02
Phenolic Resin Composition
App 20150144835 - Kosugi; Shinichi ;   et al.
2015-05-28
Resin Composition, Resin Sheet, And Cured Resin Material And Method For Producing The Same
App 20140283972 - NISHIYAMA; Tomoo ;   et al.
2014-09-25
Resin Composition, Resin Sheet, Cured Resin Sheet, Resin-adhered Metal Foil And Heat Dissipation Device
App 20140248504 - Song; Shihui ;   et al.
2014-09-04
Multilayer Resin Sheet And Process For Production Thereof, Resin Sheet Laminate And Process For Production Thereof, Cured Multilayer Resin Sheet, Metal-foil-cladded Multilayer Resin Sheet, And Semiconductor Device
App 20130189514 - Nishiyama; Tomoo ;   et al.
2013-07-25
Composite Particle, Method For Producing The Same, And Resin Composition
App 20120315487 - Takezawa; Yoshitaka ;   et al.
2012-12-13
Resin Composition, Resin Sheet, And Cured Resin Material And Method For Producing The Same
App 20120251830 - Nishiyama; Tomoo ;   et al.
2012-10-04
Multilayer Resin Sheet And Method For Producing The Same, Method For Producing Cured Multilayer Resin Sheet, And Highly Thermally Conductive Resin Sheet Laminate And Method For Producing The Same
App 20120244351 - Katagi; Hideyuki ;   et al.
2012-09-27
Manufacturing method of semiconductor device and manufacturing method of lead frame
Grant 7,989,267 - Ito , et al. August 2, 2
2011-08-02
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
Grant 7,816,786 - Nakatsu , et al. October 19, 2
2010-10-19
Resin Composition
App 20100160555 - Tanaka; Shinya ;   et al.
2010-06-24
Epoxy Resin Composition
App 20100144926 - Tanaka; Shinya ;   et al.
2010-06-10
Fiber-reinforced composite material, method for manufacturing the same, and applications thereof
Grant 7,691,473 - Yano , et al. April 6, 2
2010-04-06
Epoxy Composition
App 20100063182 - Tanaka; Shinya ;   et al.
2010-03-11
Fiber-Reinforced Composition Resin Composition, Adhesive and Sealant
App 20090298976 - Yano; Hiroyuki ;   et al.
2009-12-03
Semiconductor Unit, and Power Conversion System and On-Vehicle Electrical System Using the Same
App 20090160048 - NAKATSU; Kinya ;   et al.
2009-06-25
Epoxy compounds and cured epoxy resins obtained by curing the compounds
Grant 7,538,166 - Tanaka , et al. May 26, 2
2009-05-26
Fiber-reinforced Composite Material, Method For Manufacturing The Same, And Applications Thereof
App 20090123726 - YANO; Hiroyuki ;   et al.
2009-05-14
Epoxy Resin Composition and Cured Epoxy Resin
App 20090105388 - Tanaka; Shinya ;   et al.
2009-04-23
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
Grant 7,504,720 - Nakatsu , et al. March 17, 2
2009-03-17
Fiber-reinforced composite material, method for manufacturing the same and applications thereof
Grant 7,455,901 - Yano , et al. November 25, 2
2008-11-25
Manufacturing Method Of Semiconductor Device And Manufacturing Method Of Lead Frame
App 20080199987 - ITO; Fujio ;   et al.
2008-08-21
Manufacturing method of semiconductor device and manufacturing method of lead frame
Grant 7,374,973 - Ito , et al. May 20, 2
2008-05-20
Epoxy compound and cured epoxy resin product
Grant 7,279,574 - Tanaka , et al. October 9, 2
2007-10-09
Epoxy compounds and cured epoxy resins obtained by curing the compounds
App 20070184280 - Tanaka; Shinya ;   et al.
2007-08-09
Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
App 20070096278 - Nakatsu; Kinya ;   et al.
2007-05-03
Paper quality discriminating machine
Grant 7,167,247 - Uemura , et al. January 23, 2
2007-01-23
Semiconductor device and a manufacturing method of the same
App 20060199302 - Ito; Fujio ;   et al.
2006-09-07
Fiber-reinforced composite material, method for manufacturing the same and applications thereof
App 20060182941 - Yano; Hiroyuki ;   et al.
2006-08-17
Epoxy compound and cured epoxy resin product
App 20060159929 - Tanaka; Shinya ;   et al.
2006-07-20
Manufacturing method of semiconductor device and manufacturing method of lead frame
App 20060014321 - Ito; Fujio ;   et al.
2006-01-19
Method and apparatus of diagnosing deterioration of an article
Grant 6,852,992 - Takezawa , et al. February 8, 2
2005-02-08
Method for diagnosing nondestruction deterioration and its diagnostic apparatus
App 20040208356 - Katagiri, Junichi ;   et al.
2004-10-21
Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof
Grant 6,765,043 - Akatsuka , et al. July 20, 2
2004-07-20
Method and apparatus for paper material discrimination with two near-infrared lights
Grant 6,730,911 - Uemura , et al. May 4, 2
2004-05-04
Epoxy resin, epoxy resin composition, cured epoxy resin and manufacturing method thereof
App 20030232964 - Akatsuka, Masaki ;   et al.
2003-12-18
Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof
App 20030229159 - Akatsuka, Masaki ;   et al.
2003-12-11
Paper quality discriminating machine
App 20030197866 - Uemura, Toshiro ;   et al.
2003-10-23
Water content-measurement method and water content-measurement apparatus, and electrical component-fabrication method using the measurement apparatus and method
Grant 6,633,035 - Katagiri , et al. October 14, 2
2003-10-14
Automobile oil deterioration diagnosing apparatus
App 20030060984 - Takezawa, Yoshitaka ;   et al.
2003-03-27
Method and apparatus of diagnosing deterioration of an article
App 20030001119 - Takezawa, Yoshitaka ;   et al.
2003-01-02
Method and apparatus for paper material discrimination with two near-infrared lights
App 20020158201 - Uemura, Toshiro ;   et al.
2002-10-31
Automobile oil deterioration diagnosing apparatus
App 20020069021 - Takezawa, Yoshitaka ;   et al.
2002-06-06
Deterioration diagnosis method and device of electrical machine and apparatus
Grant 5,774,228 - Takezawa , et al. June 30, 1
1998-06-30

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