loadpatents
name:-0.075447082519531
name:-0.057890176773071
name:-0.0045390129089355
Takewaki; Toshiyuki Patent Filings

Takewaki; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takewaki; Toshiyuki.The latest application filed is for "semiconductor device and method of manufacturing semiconductor device".

Company Profile
2.52.57
  • Takewaki; Toshiyuki - Tokyo JP
  • Takewaki; Toshiyuki - Yokkaichi JP
  • Takewaki; Toshiyuki - Kawasaki JP
  • Takewaki; Toshiyuki - Kanagawa JP
  • TAKEWAKI; Toshiyuki - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and method of manufacturing semiconductor device
Grant 10,410,868 - Inoue , et al. Sept
2019-09-10
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20180151377 - Inoue; Takashi ;   et al.
2018-05-31
Method of manufacturing semiconductor device with a multi-layered gate dielectric
Grant 9,984,884 - Inoue , et al. May 29, 2
2018-05-29
Semiconductor memory device having memory cells provided in a height direction
Grant 9,812,398 - Hu , et al. November 7, 2
2017-11-07
Semiconductor memory device
Grant 9,666,597 - Hu , et al. May 30, 2
2017-05-30
Semiconductor device and a method for manufacturing a semiconductor device
Grant 9,660,045 - Inoue , et al. May 23, 2
2017-05-23
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20170103898 - INOUE; Takashi ;   et al.
2017-04-13
Semiconductor Memory Device
App 20170077130 - HU; Ming ;   et al.
2017-03-16
Semiconductor device with varying thickness of insulating film between electrode and gate electrode and method of manufacturing semiconductor device
Grant 9,559,183 - Inoue , et al. January 31, 2
2017-01-31
Semiconductor Memory Device And Method Of Manufacturing The Same
App 20160276364 - HU; Ming ;   et al.
2016-09-22
Semiconductor Memory Device
App 20160268191 - HU; Ming ;   et al.
2016-09-15
Semiconductor memory device and method of manufacturing the same
Grant 9,443,868 - Hu , et al. September 13, 2
2016-09-13
Semiconductor Device And A Method For Manufacturing A Semiconductor Device
App 20160204243 - INOUE; Takashi ;   et al.
2016-07-14
Semiconductor device
Grant 9,362,401 - Takewaki , et al. June 7, 2
2016-06-07
Semiconductor device and a method for manufacturing a semiconductor device
Grant 9,306,027 - Inoue , et al. April 5, 2
2016-04-05
Semiconductor device with high reliability and manufacturing method thereof
Grant 9,177,857 - Oshida , et al. November 3, 2
2015-11-03
Semiconductor Device
App 20150270394 - TAKEWAKI; Toshiyuki ;   et al.
2015-09-24
Semiconductor device including a strain relaxation film
Grant 9,070,661 - Takewaki , et al. June 30, 2
2015-06-30
Semiconductor Device And A Method For Manufacturing A Semiconductor Device
App 20150145004 - Inoue; Takashi ;   et al.
2015-05-28
Semiconductor Device
App 20150061038 - Takewaki; Toshiyuki ;   et al.
2015-03-05
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20140353720 - Inoue; Takashi ;   et al.
2014-12-04
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 8,642,467 - Ohto , et al. February 4, 2
2014-02-04
Semiconductor device and method of manufacturing the same
Grant 8,486,836 - Oshida , et al. July 16, 2
2013-07-16
Semiconductor device having dual damascene structure
Grant 8,487,442 - Takewaki July 16, 2
2013-07-16
Method of manufacturing semiconductor device
Grant 8,329,584 - Takewaki , et al. December 11, 2
2012-12-11
Method Of Manufacturing A High-reliability Semiconductor Device
App 20120231623 - OSHIDA; Daisuke ;   et al.
2012-09-13
Method For Manufacturing A Semiconductor Device Having A Refractory Metal Containing Film
App 20120115324 - TAKEWAKI; Toshiyuki ;   et al.
2012-05-10
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20120108060 - OHTO; Koichi ;   et al.
2012-05-03
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 8,115,318 - Ohto , et al. February 14, 2
2012-02-14
Semiconductor Device And Method Of Manufacturing The Same
App 20110318900 - OSHIDA; Daisuke ;   et al.
2011-12-29
Electrical fuse and semiconductor device
Grant 8,053,863 - Takewaki November 8, 2
2011-11-08
Semiconductor device and method of manufacturing the same
Grant 8,030,737 - Oshida , et al. October 4, 2
2011-10-04
Method Of Manufacturing Semiconductor Device
App 20110230051 - TAKEWAKI; Toshiyuki ;   et al.
2011-09-22
Semiconductor Device having dual damascene structure
App 20110169172 - Takewaki; Toshiyuki
2011-07-14
Method of manufacturing semiconductor device
Grant 7,955,980 - Takewaki , et al. June 7, 2
2011-06-07
Semiconductor device having dual damascene structure
Grant 7,936,072 - Takewaki May 3, 2
2011-05-03
Semiconductor device having projection on lower electrode and method for forming the same
Grant 7,897,475 - Oshida , et al. March 1, 2
2011-03-01
Semiconductor device having a refractory metal containing film and method for manufacturing the same
Grant 7,888,254 - Takewaki , et al. February 15, 2
2011-02-15
Semiconductor device and method for manufacturing same
Grant 7,846,830 - Takewaki , et al. December 7, 2
2010-12-07
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 7,842,602 - Ohto , et al. November 30, 2
2010-11-30
Semiconductor device including capacitor including upper electrode covered with high density insulation film and production method thereof
Grant 7,821,101 - Takewaki , et al. October 26, 2
2010-10-26
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20100224995 - Ohto; Koichi ;   et al.
2010-09-09
Semiconductor device and method of manufacturing the same
Grant 7,745,937 - Usami , et al. June 29, 2
2010-06-29
Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon
Grant 7,741,214 - Takewaki , et al. June 22, 2
2010-06-22
Semiconductor method having silicon-diffused metal wiring layer
Grant 7,737,555 - Ohto , et al. June 15, 2
2010-06-15
Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
Grant 7,728,432 - Takewaki , et al. June 1, 2
2010-06-01
Fuse and seal ring
Grant 7,692,265 - Takewaki , et al. April 6, 2
2010-04-06
Single damascene structure semiconductor device having silicon-diffused metal wiring layer
Grant 7,687,917 - Ohto , et al. March 30, 2
2010-03-30
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
Grant 7,674,704 - Takewaki March 9, 2
2010-03-09
Electrical fuse and semiconductor device
App 20100032797 - Takewaki; Toshiyuki
2010-02-11
Semiconductor device and method of manufacturing the same
Grant 7,633,138 - Takewaki , et al. December 15, 2
2009-12-15
Method Of Manufacturing Semiconductor Device
App 20090305496 - TAKEWAKI; Toshiyuki ;   et al.
2009-12-10
Method of manfacturing semiconductor device
Grant 7,601,640 - Takewaki , et al. October 13, 2
2009-10-13
Semiconductor Device With High Reliability And Manufacturing Method Thereof
App 20090184421 - Oshida; Daisuke ;   et al.
2009-07-23
Semiconductor Device Having A Refractory Metal Containing Film And Method For Manufacturing The Same
App 20090176364 - TAKEWAKI; Toshiyuki ;   et al.
2009-07-09
Method Of Manufacturing A Semiconductor Device Having An Interconnect Structure That Increases In Impurity Concentration As Width Increases
App 20090149018 - TAKEWAKI; Toshiyuki
2009-06-11
Semiconductor device having dual damascene structure
App 20090121360 - Takewaki; Toshiyuki
2009-05-14
Semiconductor Device
App 20090115022 - NAKASHIBA; Yasutaka ;   et al.
2009-05-07
Semiconductor device having a refractory metal containing film and method for manufacturing the same
Grant 7,521,802 - Takewaki , et al. April 21, 2
2009-04-21
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
Grant 7,514,352 - Takewaki April 7, 2
2009-04-07
Method Of Forming A Semiconductor Device Featuring Copper Wiring Layers Of Different Widths Having Metal Capping Layers Of Different Thicknesses Formed Thereon
App 20090081870 - Takewaki; Toshiyuki ;   et al.
2009-03-26
Semiconductor device and method of manufacturing the same
Grant 7,508,082 - Takewaki , et al. March 24, 2
2009-03-24
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same
Grant 7,479,700 - Takewaki , et al. January 20, 2
2009-01-20
Semiconductor device and manufacturing method thereof
Grant 7,476,611 - Kunishima , et al. January 13, 2
2009-01-13
Semiconductor device including capacitor including upper electrode covered with high density insulation film and production method thereof
App 20080277762 - Takewaki; Toshiyuki ;   et al.
2008-11-13
Semiconductor device having projection on lower electrode and method for forming the same
App 20080237793 - Oshida; Daisuke ;   et al.
2008-10-02
Semiconductor Device And Method Of Manufacturing The Same
App 20080217737 - OSHIDA; Daisuke ;   et al.
2008-09-11
Method Of Manfacturing Semiconcudtor Device
App 20080160750 - TAKEWAKI; Toshiyuki ;   et al.
2008-07-03
Semiconductor Device And Method Of Manufacturing Same
App 20080160686 - NAKAMATSU; Ikuo ;   et al.
2008-07-03
Semiconductor device
Grant 7,358,609 - Iguchi , et al. April 15, 2
2008-04-15
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
App 20080064202 - Takewaki; Toshiyuki
2008-03-13
Semiconductor device and method for manufacturing same
App 20080044997 - Takewaki; Toshiyuki ;   et al.
2008-02-21
Semiconductor device and method of manufacturing the same
Grant 7,327,031 - Takewaki , et al. February 5, 2
2008-02-05
Semiconductor Device And Method Of Manufacturing The Same
App 20080017993 - TAKEWAKI; Toshiyuki ;   et al.
2008-01-24
Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
Grant 7,312,535 - Takewaki , et al. December 25, 2
2007-12-25
Semiconductor device having an interconnect that increases in impurity concentration as width increases
Grant 7,274,104 - Takewaki September 25, 2
2007-09-25
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20070212809 - Ohto; Koichi ;   et al.
2007-09-13
Semiconductor device and manufacturing method for the same
Grant 7,229,921 - Hironaga , et al. June 12, 2
2007-06-12
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
App 20070108620 - Ohto; Koichi ;   et al.
2007-05-17
Semiconductor device and method of manufacturing the same
App 20070034924 - Takewaki; Toshiyuki ;   et al.
2007-02-15
Semiconductor device and method of manufacturing the same
App 20060186549 - Usami; Tatsuya ;   et al.
2006-08-24
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same
App 20060157854 - Takewaki; Toshiyuki ;   et al.
2006-07-20
Method for manufacturing semiconductor device, and processing system and semiconductor device
Grant 7,052,994 - Matsubara , et al. May 30, 2
2006-05-30
Semiconductor device and method fabricating the same
App 20060027931 - Takewaki; Toshiyuki ;   et al.
2006-02-09
Semiconductor device
App 20060017167 - Iguchi; Manabu ;   et al.
2006-01-26
Semiconductor device and method for manufacturing the same
App 20050230782 - Takewaki, Toshiyuki ;   et al.
2005-10-20
Semiconductor device and method for manufacturing the same
App 20050218477 - Takewaki, Toshiyuki ;   et al.
2005-10-06
Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof
Grant 6,949,832 - Kunishima , et al. September 27, 2
2005-09-27
Semiconductor device and method of manufacturing the same
App 20050112866 - Takewaki, Toshiyuki
2005-05-26
Semiconductor device fabricating method and treating liquid
Grant 6,890,864 - Aoki , et al. May 10, 2
2005-05-10
Semiconductor device and manufacturing method thereof
App 20050095847 - Kunishima, Hiroyuki ;   et al.
2005-05-05
Semiconductor device and method of manufacturing the same
App 20050067700 - Takewaki, Toshiyuki ;   et al.
2005-03-31
Semiconductor device and manufacturing method the same
App 20040251552 - Takewaki, Toshiyuki ;   et al.
2004-12-16
Semiconductor device and method of manufacturing the same
App 20040245643 - Takewaki, Toshiyuki ;   et al.
2004-12-09
Semiconductor device and method for manufacturing same
App 20040188851 - Takewaki, Toshiyuki ;   et al.
2004-09-30
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
App 20040046261 - Ohto, Koichi ;   et al.
2004-03-11
Semiconductor device and manufacturing method thereof
App 20040014312 - Kunishima, Hiroyuki ;   et al.
2004-01-22
Semiconductor device having silicon-including metal wiring layer and its manufacturing method
App 20030209738 - Ohto, Koichi ;   et al.
2003-11-13
Semiconductor device and manufacturing method for the same
App 20030173671 - Hironaga, Nobuo ;   et al.
2003-09-18
Semiconductor device fabricating method and treating liquid
App 20030134507 - Aoki, Hidemitsu ;   et al.
2003-07-17
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios
Grant 6,555,911 - Matsubara , et al. April 29, 2
2003-04-29
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
App 20030039845 - Iguchi, Manabu ;   et al.
2003-02-27
Semiconductor device fabricating method and treating liquid
App 20030027418 - Aoki, Hidemitsu ;   et al.
2003-02-06
Method for manufacturing a multilayer interconnection structure
App 20020009878 - Takewaki, Toshiyuki ;   et al.
2002-01-24
Method for manufacturing semiconductor device, and processing system and semiconductor device
App 20010036736 - Matsubara, Yoshihisa ;   et al.
2001-11-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed