Taketomi; Nobuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Taketomi; Nobuo.The latest application filed is for "method of manufacturing through hole of substrate".

Company Profile

6.12.16

Taketomi; Nobuo - Kodaira JP
Taketomi; Nobuo - Kawasaki N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing through hole of substrate Grant 10,863,629 - Hatanaka , et al. December 8, 2	2020-12-08
Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring board Grant 10,624,216 - Taketomi , et al.	2020-04-14
Printed wiring board, crack prediction device, and crack prediction method Grant 10,605,851 - Iriguchi , et al.	2020-03-31
Method Of Manufacturing Through Hole Of Substrate App 20200037452 - Hatanaka; Kiyoyuki ; et al.	2020-01-30
Substrate and method of manufacturing the same Grant 10,342,129 - Iriguchi , et al.	2019-07-02
Wiring Board, Electronic Apparatus, Method For Attaching Sheet Metal Covers, And Method For Manufacturing Wiring Board App 20190110365 - Taketomi; Nobuo ; et al.	2019-04-11
Substrate And Method Of Manufacturing The Same App 20180310405 - Iriguchi; Shigeo ; et al.	2018-10-25
Printed Wiring Board, Crack Prediction Device, And Crack Prediction Method App 20170285096 - IRIGUCHI; Shigeo ; et al.	2017-10-05
Printed wiring board, crack prediction device, and crack prediction method Grant 9,709,619 - Iriguchi , et al. July 18, 2	2017-07-18
Rigid Flexible Board And Method For Manufacturing The Same App 20170196077 - IRIGUCHI; Shigeo ; et al.	2017-07-06
Substrate with embedded component Grant 9,591,763 - Abe , et al. March 7, 2	2017-03-07
Substrate With Embedded Component App 20160324005 - Abe; Mitsunori ; et al.	2016-11-03
Flexible printed board Grant 9,295,155 - Nakamura , et al. March 22, 2	2016-03-22
Printed Wiring Board, Crack Prediction Device, And Crack Prediction Method App 20140077834 - IRIGUCHI; Shigeo ; et al.	2014-03-20
Method of repair of electronic device and repair system Grant 8,456,854 - Iriguchi , et al. June 4, 2	2013-06-04
Flexible Printed Board App 20120312586 - Nakamura; Naoki ; et al.	2012-12-13
Flexible printed board Grant 8,269,114 - Nakamura , et al. September 18, 2	2012-09-18
Multilayer Printed Circuit Board Using Flexible Interconnect Structure, And Method Of Making Same App 20110286188 - KANAI; Ryo ; et al.	2011-11-24
Printed Circuit Board Unit, Electronic Device And Method Of Fabricating Printed Circuit Board App 20110240355 - NAKAMURA; Naoki ; et al.	2011-10-06
Printed Circuit Board And Method Of Fabricating Printed Circuit Board App 20110240352 - NAKAMURA; Naoki ; et al.	2011-10-06
Multilayer Printed Circuit Board, Method For Manufacturing The Same, And Electronic Apparatus App 20110132654 - TAKETOMI; Nobuo ; et al.	2011-06-09
Flexible Printed Board App 20100212938 - Nakamura; Naoki ; et al.	2010-08-26
Method For Producing Electronic Part Unit App 20100200643 - Taketomi; Nobuo ; et al.	2010-08-12
Method of repair of electronic device and repair system App 20090175010 - Iriguchi; Shigeo ; et al.	2009-07-09
Electronic apparatus Grant 7,101,205 - Hatanaka , et al. September 5, 2	2006-09-05
Electronic apparatus App 20060073711 - Hatanaka; Kiyoyuki ; et al.	2006-04-06

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