TAKESUE; Masakazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKESUE; Masakazu.The latest application filed is for "printed circuit board and manufacturing method thereof".

Company Profile

0.8.17

TAKESUE; Masakazu - Kawasaki JP
Takesue, Masakazu - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed Circuit Board And Manufacturing Method Thereof App 20150271928 - TAKESUE; Masakazu	2015-09-24
Printed Circuit Board And Manufacturing Method Thereof App 20130256016 - TAKESUE; Masakazu	2013-10-03
Micro component removing method Grant 7,963,434 - Yamamoto , et al. June 21, 2	2011-06-21
Printed Wiring Board And Electronic Apparatus App 20110141705 - TAKESUE; Masakazu ; et al.	2011-06-16
Micro Component Removing Method App 20100213248 - YAMAMOTO; Keiichi ; et al.	2010-08-26
Micro component removing apparatus Grant 7,753,251 - Yamamoto , et al. July 13, 2	2010-07-13
Substrate Unit, Information Processor And Method Of Manufacturing Substrate Unit App 20100101848 - Maeno; Yoshinobu ; et al.	2010-04-29
Mounting substrate and mounting method of electronic part Grant 7,491,893 - Takesue February 17, 2	2009-02-17
Micro Component Removing Method And Micro Component Removing Apparatus App 20080099536 - YAMAMOTO; Keiichi ; et al.	2008-05-01
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy Grant 6,984,254 - Takesue , et al. January 10, 2	2006-01-10
Mounting substrate and mounting method of electronic part App 20050224560 - Takesue, Masakazu	2005-10-13
Solder alloy and soldered bond Grant 6,893,512 - Kitajima , et al. May 17, 2	2005-05-17
Semiconductor device with gold bumps, and method and apparatus of producing the same Grant 6,786,385 - Kitajima , et al. September 7, 2	2004-09-07
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method Grant 6,744,183 - Kitajima , et al. June 1, 2	2004-06-01
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20040052678 - Takesue, Masakazu ; et al.	2004-03-18
Solder alloy and soldered bond App 20030143104 - Kitajima, Masayuki ; et al.	2003-07-31
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20030137223 - Kitajima, Masayuki ; et al.	2003-07-24
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20030095888 - Kitajima, Masayuki ; et al.	2003-05-22
Semiconductor device with gold bumps, and method and apparatus of producing the same App 20020100972 - Kitajima, Masayuki ; et al.	2002-08-01
Solder paste and electronic device App 20020102432 - Ochiai, Masayuki ; et al.	2002-08-01
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20020074902 - Kitajima, Masayuki ; et al.	2002-06-20
Method of assembling micro-actuator App 20020059717 - Okada, Toru ; et al.	2002-05-23
Soldering method and soldered joint App 20020018844 - Kitajima, Masayuki ; et al.	2002-02-14
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20010001990 - Kitajima, Masayuki ; et al.	2001-05-31
Lead-free solder composition with Bi, In and Sn Grant 6,184,475 - Kitajima , et al. February 6, 2	2001-02-06

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