loadpatents
name:-0.0099868774414062
name:-0.0089201927185059
name:-0.00043511390686035
Takeshima; Hidehiro Patent Filings

Takeshima; Hidehiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takeshima; Hidehiro.The latest application filed is for "stacked semiconductor device and fabrication method for same".

Company Profile
0.10.10
  • Takeshima; Hidehiro - Chuo-ku JP
  • Takeshima; Hidehiro - Tokyo N/A JP
  • Takeshima; Hidehiro - Akita JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stacked semiconductor device and fabrication method for same
Grant 9,252,125 - Kagaya , et al. February 2, 2
2016-02-02
Semiconductor device and method of manufacturing the same
Grant 8,648,455 - Takeshima February 11, 2
2014-02-11
Stacked Semiconductor Device And Fabrication Method For Same
App 20130001755 - KAGAYA; Yutaka ;   et al.
2013-01-03
Semiconductor device with hollow and throughhole and method of manufacturing same
Grant 8,253,258 - Sonobe , et al. August 28, 2
2012-08-28
Stacked semiconductor device and fabrication method for same
Grant 8,247,896 - Kagaya , et al. August 21, 2
2012-08-21
Method of analyzing thermal stress according to filling factor of filler in resin
Grant 8,215,829 - Kono , et al. July 10, 2
2012-07-10
Semiconductor Device And Method Of Manufacturing The Same
App 20110291244 - TAKESHIMA; Hidehiro
2011-12-01
Semiconductor device and manufacturing method of the same
Grant 7,935,576 - Kagaya , et al. May 3, 2
2011-05-03
Semiconductor Device
App 20110074037 - TAKESHIMA; Hidehiro ;   et al.
2011-03-31
Stacked Semiconductor Device And Fabrication Method For Same
App 20110001235 - KAGAYA; Yutaka ;   et al.
2011-01-06
Stacked semiconductor device
Grant 7,808,093 - Kagaya , et al. October 5, 2
2010-10-05
Semiconductor Device And Method Of Manufacturing Same
App 20100244234 - SONOBE; Kaoru ;   et al.
2010-09-30
Method Of Analyzing Thermal Stress According To Filling Factor Of Filler In Resin
App 20100103977 - KONO; Tsutomu ;   et al.
2010-04-29
Semiconductor device and manufacturing method of the same
App 20090096097 - Kagaya; Yutaka ;   et al.
2009-04-16
Stacked Semiconductor Device And Fabrication Method For Same
App 20070241437 - Kagaya; Yutaka ;   et al.
2007-10-18
Semiconductor device
App 20060163745 - Yamashita; Shiro ;   et al.
2006-07-27
Semiconductor device and manufacture method of that
Grant 6,670,220 - Sakuraba , et al. December 30, 2
2003-12-30
Semiconductor device and manufacture method of that
App 20020024127 - Sakuraba, Tadaki ;   et al.
2002-02-28

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