Takenaka; Takaji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takenaka; Takaji.The latest application filed is for "structure for mounting a semiconductor device and a capacitor device on a substrate".
- Takenaka; Takaji - Hadano JP
- Takenaka; Takaji - Hatano JP
| Patent | Date |
|---|---|
| Structure for mounting a semiconductor device and a capacitor device on a substrate Grant 6,272,020 - Tosaki , et al. August 7, 2 | 2001-08-07 |
| Methods of recovering a multi-layer printed circuit board Grant 5,257,452 - Imai , et al. November 2, 1 | 1993-11-02 |
| Multi-chip module structure Grant 4,930,002 - Takenaka , et al. May 29, 1 | 1990-05-29 |
| Method and apparatus for airtightly packaging semiconductor package Grant 4,836,434 - Takenaka , et al. June 6, 1 | 1989-06-06 |
| Circuit board Grant 4,725,925 - Tanaka , et al. February 16, 1 | 1988-02-16 |
| Multilayer circuit board Grant 4,706,165 - Takenaka , et al. November 10, 1 | 1987-11-10 |
| Heat transfer apparatus Grant 4,619,316 - Nakayama , et al. October 28, 1 | 1986-10-28 |
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