| Patent | Date |
|---|
Semiconductor device and manufacturing method therefor
Grant 9,355,974 - Takenaka , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device And Manufacturing Method Therefor
App 20150357299 - Takenaka; Masashi ; et al. | 2015-12-10 |
Semiconductor device and manufacturing method therefor
Grant 9,142,516 - Takenaka , et al. September 22, 2 | 2015-09-22 |
Semiconductor Device And Manufacturing Method Therefor
App 20130026649 - Takenaka; Masashi ; et al. | 2013-01-31 |
Imaging apparatus
Grant 7,564,111 - Sawahata , et al. July 21, 2 | 2009-07-21 |
Imaging apparatus
App 20070120050 - Sawahata; Koji ; et al. | 2007-05-31 |
Semiconductor device having a heat spreader exposed from a seal resin
App 20070114642 - Hosoyamada; Sumikazu ; et al. | 2007-05-24 |
Semiconductor device having a heat spreader exposed from a seal resin
Grant 7,193,320 - Hosoyamada , et al. March 20, 2 | 2007-03-20 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
Grant 6,881,611 - Fukasawa , et al. April 19, 2 | 2005-04-19 |
Semiconductor device having a heat spreader exposed from a seal resin
App 20030222344 - Hosoyamada, Sumikazu ; et al. | 2003-12-04 |
Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
App 20020030258 - Fukasawa, Norio ; et al. | 2002-03-14 |
Semiconductor device and method of forming the same
Grant 6,347,037 - Iijima , et al. February 12, 2 | 2002-02-12 |
Semiconductor Device And Method Of Forming The Same.
App 20020001178 - IIJIMA, MAKOTO ; et al. | 2002-01-03 |
Method And Mold For Manufacturing Semiconductor Device, Semiconductor Device, And Method For Mounting The Device
App 20010003049 - FUKASAWA, NORIO ; et al. | 2001-06-07 |
Semiconductor device and method of forming the device
Grant 5,920,117 - Sono , et al. July 6, 1 | 1999-07-06 |
Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device
Grant 5,831,441 - Motooka , et al. November 3, 1 | 1998-11-03 |
Semiconductor device and assembly board having through-holes filled with filling core
Grant 5,729,435 - Iijima , et al. March 17, 1 | 1998-03-17 |
Semiconductor device and semiconductor device unit having ball-grid-array type package structure
Grant 5,726,493 - Yamashita , et al. March 10, 1 | 1998-03-10 |
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
Grant 5,666,064 - Kasai , et al. September 9, 1 | 1997-09-09 |
Semiconductor device having upper and lower package bodies and manufacturing method thereof
Grant 5,656,864 - Mitsue , et al. August 12, 1 | 1997-08-12 |
Process for encapsulating a semiconductor package having a heat sink using a jig
Grant 5,444,025 - Sono , et al. August 22, 1 | 1995-08-22 |
| 