Takemura; Akihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takemura; Akihiro.The latest application filed is for "fuel tank system for vehicle and abnormality diagnosis method of the fuel tank system".

Company Profile

0.9.12

Takemura; Akihiro - Tokyo JP
Takemura; Akihiro - Yokkaichi-shi JP
Takemura; Akihiro - Yokkaichi N/A JP
Takemura; Akihiro - Mie-ken JP
Takemura; Akihiro - Mie JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fuel Tank System For Vehicle And Abnormality Diagnosis Method Of The Fuel Tank System App 20210370761 - OKAZAKI; Kazuya ; et al.	2021-12-02
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method For Semiconductor Device App 20140011360 - NAMIE; Yuuji ; et al.	2014-01-09
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device Grant 8,574,330 - Namie , et al. November 5, 2	2013-11-05
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method Grant 8,506,359 - Shida , et al. August 13, 2	2013-08-13
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 8,492,276 - Abe , et al. July 23, 2	2013-07-23
Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method Grant 8,480,920 - Shida , et al. July 9, 2	2013-07-09
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method Using Same App 20130005219 - Takemura; Akihiro ; et al.	2013-01-03
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method App 20110081780 - Shida; Hirotaka ; et al.	2011-04-07
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method App 20110053462 - Shida; Hirotaka ; et al.	2011-03-03
Chemical Mechanical Polishing Aqueous Dispersion, Method Of Preparing The Same, Chemical Mechanical Polishing Aqueous Dispersion Preparation Kit, And Chemical Mechanical Polishing Method App 20100252774 - SHIDA; Hirotaka ; et al.	2010-10-07
Aqueous Dispersion For Chemical Mechanical Polishing And Method For Preparing The Same, Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing, And Chemical Mechanical Polishing Method For Semiconductor Device App 20100221918 - Takemura; Akihiro ; et al.	2010-09-02
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method App 20100075501 - ABE; Taichi ; et al.	2010-03-25
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing App 20090302266 - Takemura; Akihiro ; et al.	2009-12-10
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method For Semiconductor Device App 20090221213 - Namie; Yuuji ; et al.	2009-09-03
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices App 20070049180 - Shida; Hirotaka ; et al.	2007-03-01
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing Grant 7,005,382 - Nishimoto , et al. February 28, 2	2006-02-28
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing App 20040132305 - Nishimoto, Kazuo ; et al.	2004-07-08

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