Takemoto; Megumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takemoto; Megumi.The latest application filed is for "test jig".

Company Profile

0.11.10

Takemoto; Megumi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test jig for testing a packaged high frequency semiconductor device Grant 7,825,677 - Takemoto , et al. November 2, 2	2010-11-02
Test Jig App 20100052722 - Takemoto; Megumi ; et al.	2010-03-04
Semiconductor device test probe Grant 7,276,923 - Takemoto , et al. October 2, 2	2007-10-02
Semiconductor device test probe Grant 7,274,195 - Takemoto , et al. September 25, 2	2007-09-25
Semiconductor device test probe App 20060038575 - Takemoto; Megumi ; et al.	2006-02-23
Semiconductor Device Test Probe Having Improved Tip Portion App 20050189955 - Takemoto, Megumi ; et al.	2005-09-01
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,888,344 - Maekawa , et al. May 3, 2	2005-05-03
Probe card, and testing apparatus having the same Grant 6,885,204 - Takemoto , et al. April 26, 2	2005-04-26
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus Grant 6,741,086 - Maekawa , et al. May 25, 2	2004-05-25
Probe card, and testing apparatus having the same App 20040046580 - Takemoto, Megumi ; et al.	2004-03-11
Probe card, and testing apparatus having the same Grant 6,667,626 - Takemoto , et al. December 23, 2	2003-12-23
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter Grant 6,646,455 - Maekawa , et al. November 11, 2	2003-11-11
Semiconductor device test probe having improved tip portion and manufacturing method thereof Grant 6,633,176 - Takemoto , et al. October 14, 2	2003-10-14
Probe card for testing semiconductor integrated circuit and method of manufacturing the same Grant 6,628,127 - Takemoto , et al. September 30, 2	2003-09-30
Probe card, and testing apparatus having the same App 20030160624 - Takemoto, Megumi ; et al.	2003-08-28
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter App 20030090280 - Maekawa, Shigeki ; et al.	2003-05-15
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus App 20020190737 - Maekawa, Shigeki ; et al.	2002-12-19
Test Probe For Semiconductor Devices, Method Of Manufacturing Of The Same, And Member For Removing Foreign Matter App 20020097060 - MAEKAWA, SHIGEKI ; et al.	2002-07-25
Semiconductor device test probe, manufacturing method therefor and semiconductor device tested by the probe App 20010046715 - Takemoto, Megumi ; et al.	2001-11-29
Probe card for testing semiconductor integrated circuit and method of manufacturing the same App 20010015650 - Takemoto, Megumi ; et al.	2001-08-23
Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material Grant 5,972,069 - Maekawa , et al. October 26, 1	1999-10-26

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