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Patent applications and USPTO patent grants for Takemori; Michael Teruki.The latest application filed is for "thermo-responsive assembly and methods for making and using the same".
Patent | Date |
---|---|
Thermo-responsive Assembly And Methods For Making And Using The Same App 20140272282 - Pickett; James Edward ;   et al. | 2014-09-18 |
Light transmissive articles and methods thereof Grant 8,765,029 - Boden , et al. July 1, 2 | 2014-07-01 |
Complex holograms, method of making and using complex holograms Grant 8,715,887 - Takemori , et al. May 6, 2 | 2014-05-06 |
Complex Holograms, Method Of Making And Using Complex Holograms App 20120026564 - Takemori; Michael Teruki ;   et al. | 2012-02-02 |
Transparent articles prepared from thermoplastic compositions having low birefringence Grant 8,064,140 - Hoeks , et al. November 22, 2 | 2011-11-22 |
Transparent Articles Prepared From Thermoplastic Compositions Having Low Birefringence App 20110071261 - Hoeks; Theodorus Lambertus ;   et al. | 2011-03-24 |
Optical Data Storage Medium And Methods For Using The Same App 20100302927 - Natarajan; Arunkumar ;   et al. | 2010-12-02 |
Glossy colored injection molded article Grant 7,816,444 - Kamps , et al. October 19, 2 | 2010-10-19 |
Holographic Energy-collecting Medium And Associated Device App 20100180937 - Jain; Sumeet ;   et al. | 2010-07-22 |
Light transmissive articles and methods thereof App 20080130129 - Boden; Eugene Pauling ;   et al. | 2008-06-05 |
Glossy Colored Injection Molded Article App 20080011513 - Kamps; Jan Henk ;   et al. | 2008-01-17 |
Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s) Grant 6,784,260 - Yeager , et al. August 31, 2 | 2004-08-31 |
Powder coating compositions App 20030236361 - Yeager, Gary William ;   et al. | 2003-12-25 |
Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) Grant 6,576,718 - Yeager , et al. June 10, 2 | 2003-06-10 |
Polyetherimide resin/polyester resin blends having improved properties Grant 6,150,473 - Brown , et al. November 21, 2 | 2000-11-21 |
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