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name:-0.014225959777832
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TAKEICHI; Motohide Patent Filings

TAKEICHI; Motohide

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKEICHI; Motohide.The latest application filed is for "semiconductor devices connected by anisotropic conductive film comprising conductive microspheres".

Company Profile
0.11.8
  • TAKEICHI; Motohide - Uiwang-si KR
  • Takeichi; Motohide - Kanuma JP
  • Takeichi, Motohide - Kanuma-shi JP
  • Takeichi; Motohide - Yono JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Devices Connected By Anisotropic Conductive Film Comprising Conductive Microspheres
App 20130154095 - YU; Arum ;   et al.
2013-06-20
COG-assembly and connecting material to be used therein
Grant 6,903,463 - Takeichi , et al. June 7, 2
2005-06-07
Adhesive material and circuit connection method
App 20040029992 - Takeichi, Motohide ;   et al.
2004-02-12
Thermosetting adhesive material
Grant 6,673,858 - Takeichi , et al. January 6, 2
2004-01-06
Adhesives and electric devices
Grant 6,641,928 - Takeichi , et al. November 4, 2
2003-11-04
Adhesive material and circuit connection method
Grant 6,632,320 - Takeichi , et al. October 14, 2
2003-10-14
Connection material
Grant 6,611,065 - Takeichi , et al. August 26, 2
2003-08-26
Method for mounting electronic elements
Grant 6,531,026 - Takeichi , et al. March 11, 2
2003-03-11
Connecting material
Grant 6,514,433 - Takeichi , et al. February 4, 2
2003-02-04
Connection material
App 20020098319 - Takeichi, Motohide ;   et al.
2002-07-25
Adhesives and electric devices
App 20020062918 - Takeichi, Motohide ;   et al.
2002-05-30
Packaging method
Grant 6,349,872 - Yamada , et al. February 26, 2
2002-02-26
Connecting material and connection structure
App 20020009597 - Shinozaki, Junji ;   et al.
2002-01-24
Anisotropically electroconductive adhesive material and connecting method
App 20010026866 - Suga, Yasuhiro ;   et al.
2001-10-04
Thermosetting adhesive material
App 20010020697 - Takeichi, Motohide ;   et al.
2001-09-13
Anisotropically electroconductive adhesive and adhesive film
Grant 5,965,064 - Yamada , et al. October 12, 1
1999-10-12
Battery and protecting element therefor
Grant 5,939,217 - Tamura , et al. August 17, 1
1999-08-17
Protective device
Grant 5,712,610 - Takeichi , et al. January 27, 1
1998-01-27

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