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Patent applications and USPTO patent grants for TAKEICHI; Motohide.The latest application filed is for "semiconductor devices connected by anisotropic conductive film comprising conductive microspheres".
Patent | Date |
---|---|
Semiconductor Devices Connected By Anisotropic Conductive Film Comprising Conductive Microspheres App 20130154095 - YU; Arum ;   et al. | 2013-06-20 |
COG-assembly and connecting material to be used therein Grant 6,903,463 - Takeichi , et al. June 7, 2 | 2005-06-07 |
Adhesive material and circuit connection method App 20040029992 - Takeichi, Motohide ;   et al. | 2004-02-12 |
Thermosetting adhesive material Grant 6,673,858 - Takeichi , et al. January 6, 2 | 2004-01-06 |
Adhesives and electric devices Grant 6,641,928 - Takeichi , et al. November 4, 2 | 2003-11-04 |
Adhesive material and circuit connection method Grant 6,632,320 - Takeichi , et al. October 14, 2 | 2003-10-14 |
Connection material Grant 6,611,065 - Takeichi , et al. August 26, 2 | 2003-08-26 |
Method for mounting electronic elements Grant 6,531,026 - Takeichi , et al. March 11, 2 | 2003-03-11 |
Connecting material Grant 6,514,433 - Takeichi , et al. February 4, 2 | 2003-02-04 |
Connection material App 20020098319 - Takeichi, Motohide ;   et al. | 2002-07-25 |
Adhesives and electric devices App 20020062918 - Takeichi, Motohide ;   et al. | 2002-05-30 |
Packaging method Grant 6,349,872 - Yamada , et al. February 26, 2 | 2002-02-26 |
Connecting material and connection structure App 20020009597 - Shinozaki, Junji ;   et al. | 2002-01-24 |
Anisotropically electroconductive adhesive material and connecting method App 20010026866 - Suga, Yasuhiro ;   et al. | 2001-10-04 |
Thermosetting adhesive material App 20010020697 - Takeichi, Motohide ;   et al. | 2001-09-13 |
Anisotropically electroconductive adhesive and adhesive film Grant 5,965,064 - Yamada , et al. October 12, 1 | 1999-10-12 |
Battery and protecting element therefor Grant 5,939,217 - Tamura , et al. August 17, 1 | 1999-08-17 |
Protective device Grant 5,712,610 - Takeichi , et al. January 27, 1 | 1998-01-27 |
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