Takei; Tokio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takei; Tokio.The latest application filed is for "method for producing bonded wafer, bonded wafer, and surface grinding machine".

Company Profile

0.6.4

Takei; Tokio - Nagano JP
Takei; Tokio - Nagano-ken JP
Takei; Tokio - Kawanakajima-machi Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer Grant 7,727,860 - Miyazaki , et al. June 1, 2	2010-06-01
Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding Machine App 20090233109 - Okabe; Keiichi ; et al.	2009-09-17
Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer App 20090042363 - Miyazaki; Susumu ; et al.	2009-02-12
Method for Manufacturing Bonded Wafer and Bonded Wafer App 20080315349 - Takei; Tokio ; et al.	2008-12-25
Production method for silicon wafer and SOI wafer, and SOI wafer Grant 6,583,029 - Abe , et al. June 24, 2	2003-06-24
Production method for silicon wafer and soi wafer, and soi wafer App 20030008478 - Abe, Takao ; et al.	2003-01-09
Method of manufacturing a bonding substrate Grant 6,110,391 - Takei , et al. August 29, 2	2000-08-29
Wafer holding jig Grant 5,938,512 - Takei , et al. August 17, 1	1999-08-17
Bonded wafer and method of manufacturing it Grant 5,340,435 - Ito , et al. August 23, 1	1994-08-23
Method for preparing a substrate for forming semiconductor devices by bonding warped wafers Grant 5,071,785 - Nakazato , et al. December 10, 1	1991-12-10

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