Takeda; Tsutomu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takeda; Tsutomu.The latest application filed is for "electronic component, and electronic component manufacturing method".

Company Profile

1.13.9

Takeda; Tsutomu - Tokyo JP
Takeda; Tsutomu - Takasago JP
Takeda; Tsutomu - Takasago-shi JP
Takeda; Tsutomu - Miyagi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component, and electronic component manufacturing method Grant 10,643,976 - Otsuka , et al.	2020-05-05
Build-up welding material and machinery part welded with weld overlay metal Grant 10,286,500 - Kobayashi , et al.	2019-05-14
Electronic Component, And Electronic Component Manufacturing Method App 20180261577 - OTSUKA; Yurika ; et al.	2018-09-13
Electronic component and electronic component cooling method Grant 9,263,365 - Takeda February 16, 2	2016-02-16
Interposer and semiconductor device Grant 9,136,210 - Takeda September 15, 2	2015-09-15
Build-up welding material, deposited metal, and member with deposited metal Grant 9,028,746 - Takeda , et al. May 12, 2	2015-05-12
Build-up Welding Material And Machinery Part Welded With Weld Overlay Metal App 20140322560 - Kobayashi; Ryuichi ; et al.	2014-10-30
Electronic Component And Electronic Component Cooling Method App 20140254099 - TAKEDA; TSUTOMU	2014-09-11
Wiring board having via and method forming a via in a wiring board Grant 8,604,357 - Takeda December 10, 2	2013-12-10
Wiring board Grant 8,507,807 - Takeda August 13, 2	2013-08-13
Build-up Welding Material, Deposited Metal, And Member With Deposited Metal App 20130171472 - Takeda; Tsutomu ; et al.	2013-07-04
Interposer And Semiconductor Device App 20120139010 - TAKEDA; TSUTOMU	2012-06-07
Wiring Board App 20110226516 - TAKEDA; TSUTOMU	2011-09-22
Multilayer printed circuit board and method of manufacturing same Grant 7,750,249 - Takeda July 6, 2	2010-07-06
Wiring Board Having Via And Method Forming A Via In A Wiring Board App 20100012366 - Takeda; Tsutomu	2010-01-21
Multilayer Printed Circuit Board And Method Of Manufacturing Same App 20080218985 - TAKEDA; TSUTOMU	2008-09-11
Base film for magnetic recording medium and magnetic recording medium using same Grant 5,976,668 - Chiba , et al. November 2, 1	1999-11-02

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