Takeda; Toshimitsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takeda; Toshimitsu.The latest application filed is for "connector for led module substrate".
- Takeda; Toshimitsu - Toyama JP
- Takeda; Toshimitsu - Toyama-shi JP
- Takeda; Toshimitsu - Oiwake Hiratsuka JP
- Takeda, Toshimitsu - Oiwake Hiratsuka City JP
| Patent | Date |
|---|---|
| Electrical connector Grant D816,036 - Takeda , et al. April 24, 2 | 2018-04-24 |
| Connector for LED module substrate Grant 9,903,538 - Takeda , et al. February 27, 2 | 2018-02-27 |
| Connector For Led Module Substrate App 20170102115 - TAKEDA; Toshimitsu ; et al. | 2017-04-13 |
| Electrical connector Grant D764,414 - Takeda August 23, 2 | 2016-08-23 |
| Electric connector Grant D753,592 - Takeda April 12, 2 | 2016-04-12 |
| Electric connector Grant D749,518 - Takeda February 16, 2 | 2016-02-16 |
| Electric connector Grant D744,425 - Takeda December 1, 2 | 2015-12-01 |
| Connector For Led Module Board App 20140179139 - Tanaka; Katsuyoshi ; et al. | 2014-06-26 |
| One-part, room temperature moisture curable resin composition Grant 6,936,676 - Okuhira , et al. August 30, 2 | 2005-08-30 |
| One-part, room temperature moisture curable resin composition App 20040192873 - Okuhira, Hiroyuki ; et al. | 2004-09-30 |
| One-part, room temperature moisture curable resin composition Grant 6,756,466 - Okuhira , et al. June 29, 2 | 2004-06-29 |
| One-part, room temperature moisture curable resin composition App 20040106766 - Okuhira, Hiroyuki ; et al. | 2004-06-03 |
| One-part, room temperature moisture curable resin composition App 20030139559 - Okuhira, Hiroyuki ; et al. | 2003-07-24 |
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