TAKE; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKE; Seiji.The latest application filed is for "wiring board and method for manufacturing wiring board".

Company Profile

1.16.11

TAKE; Seiji - Tokyo JP
TAKE; Seiji - Tokyo-to JP
Take; Seiji - Nagareyama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Board And Method For Manufacturing Wiring Board App 20220201838 - SUZUKI; Koichi ; et al.	2022-06-23
Wiring Board And Method For Manufacturing Wiring Board App 20220037777 - SUZUKI; Koichi ; et al.	2022-02-03
Wiring Board And Method For Manufacturing Wiring Board App 20200373653 - SUZUKI; Koichi ; et al.	2020-11-26
Light emitting device having quantum cut dots with a protecting material and prolonged drive lifetime and good color purity Grant 9,155,159 - Okada , et al. October 6, 2	2015-10-06
Device material for hole injection transport layer, ink for forming hole injection transport layer, device comprising hole injection transport layer, and method for producing the device Grant 9,102,872 - Ueno , et al. August 11, 2	2015-08-11
Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layer Grant 8,785,921 - Ueno , et al. July 22, 2	2014-07-22
Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layer Grant 8,778,233 - Ueno , et al. July 15, 2	2014-07-15
Device Comprising Positive Hole Injection Transport Layer, Method For Producing The Same And Ink For Forming Positive Hole Injection Transport Layer App 20120211705 - UENO; Shigehiro ; et al.	2012-08-23
Device Material For Hole Injection Transport Layer, Ink For Forming Hole Injection Transport Layer, Device Comprising Hole Injection Transport Layer, And Method For Producing The Device App 20120119200 - Ueno; Shigehiro ; et al.	2012-05-17
Device Comprising Positive Hole Injection Transport Layer, Method For Producing The Same And Ink For Forming Positive Hole Injection Transport Layer App 20110163327 - Ueno; Shigehiro ; et al.	2011-07-07
Light Emitting Device App 20100237322 - Okada; Masato ; et al.	2010-09-23
InSb NANOPARTICLE App 20090007726 - TAKE; Seiji	2009-01-08
Thermoelectric conversion materials Grant 7,259,320 - Take August 21, 2	2007-08-21
Inorganic nanoparticle and method for producing the same Grant 7,255,922 - Take August 14, 2	2007-08-14
InSb nanoparticle App 20060094860 - Take; Seiji	2006-05-04
Thermoelectric conversion materials App 20050268956 - Take, Seiji	2005-12-08
Inorganic nanoparticle and method for producing the same App 20050255319 - Take, Seiji	2005-11-17
Electrostatic information recording medium and electrostatic information recording and reproducing method Grant 5,731,116 - Matsuo , et al. March 24, 1	1998-03-24
Electrostatic information recording medium and electrostatic information recording and reproducing method Grant 5,718,996 - Iijima , et al. February 17, 1	1998-02-17
Method of producing information recording medium Grant 5,683,838 - Iijima , et al. November 4, 1	1997-11-04
Electrostatic information recording medium and electrostatic information recording and reproducing method Grant 5,587,264 - Iijima , et al. December 24, 1	1996-12-24
Electrostatic information recording medium and electrostatic information recording and reproducing method Grant 5,439,768 - Matsuo , et al. August 8, 1	1995-08-08
IC card Grant 4,841,134 - Hida , et al. June 20, 1	1989-06-20

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