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Patent applications and USPTO patent grants for Takayanagi; Hideki.The latest application filed is for "device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium".
Patent | Date |
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Method of removing liquid from seal of a substrate holder Grant 11,230,789 - Seki , et al. January 25, 2 | 2022-01-25 |
Device For Measuring Bump Height, Apparatus For Processing Substrate, Method Of Measuring Bump Height, And Storage Medium App 20210285893 - Okuzono; Takahisa ;   et al. | 2021-09-16 |
Method Of Removing Liquid From Seal Of A Substrate Holder App 20200199769 - Seki; Masaya ;   et al. | 2020-06-25 |
Assembly apparatus and control method therefor Grant 10,611,027 - Kobori , et al. | 2020-04-07 |
Substrate Holder And Plating Apparatus App 20190390359 - Seki; Masaya ;   et al. | 2019-12-26 |
Assembly Apparatus And Control Method Therefor App 20180272533 - Kobori; Yuji ;   et al. | 2018-09-27 |
Substrate holding apparatus Grant 7,850,509 - Togawa , et al. December 14, 2 | 2010-12-14 |
Substrate holding apparatus App 20090061748 - TOGAWA; Tetsuji ;   et al. | 2009-03-05 |
Substrate holding apparatus Grant 7,491,117 - Togawa , et al. February 17, 2 | 2009-02-17 |
Substrate polishing machine Grant 7,156,725 - Togawa , et al. January 2, 2 | 2007-01-02 |
Substrate holding apparatus App 20060234609 - Togawa; Tetsuji ;   et al. | 2006-10-19 |
Substrate holding apparatus Grant 7,083,507 - Togawa , et al. August 1, 2 | 2006-08-01 |
Substrate holding apparatus App 20050118935 - Togawa, Tetsuji ;   et al. | 2005-06-02 |
Substrate holding apparatus Grant 6,852,019 - Togawa , et al. February 8, 2 | 2005-02-08 |
Substrate polishing machine App 20040209560 - Togawa, Tetsuji ;   et al. | 2004-10-21 |
Substrate holding apparatus App 20020042246 - Togawa, Tetsuji ;   et al. | 2002-04-11 |
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