loadpatents
Patent applications and USPTO patent grants for Takayama; Wataru.The latest application filed is for "plasma processing apparatus and method of transferring workpiece".
Patent | Date |
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Plasma processing method and plasma processing apparatus Grant 10,867,777 - Takayama , et al. December 15, 2 | 2020-12-15 |
Plasma etching method Grant 10,707,090 - Takayama , et al. | 2020-07-07 |
Etching process method Grant 10,692,729 - Kudo , et al. | 2020-06-23 |
Plasma Processing Apparatus And Method Of Transferring Workpiece App 20190304824 - SUZUKI; Takayuki ;   et al. | 2019-10-03 |
Plasma Processing Method And Plasma Processing Apparatus App 20190279850 - Takayama; Wataru ;   et al. | 2019-09-12 |
Plasma Etching Method App 20180226264 - TAKAYAMA; Wataru ;   et al. | 2018-08-09 |
Plasma etching method Grant 9,966,273 - Takayama , et al. May 8, 2 | 2018-05-08 |
Etching Process Method App 20170372916 - KUDO; Jin ;   et al. | 2017-12-28 |
Etching method Grant 9,779,961 - Saitoh , et al. October 3, 2 | 2017-10-03 |
Plasma Etching Method App 20170162399 - TAKAYAMA; Wataru ;   et al. | 2017-06-08 |
Etching method Grant 9,666,446 - Tominaga , et al. May 30, 2 | 2017-05-30 |
Etching Method App 20160314986 - TOMINAGA; Sho ;   et al. | 2016-10-27 |
Etching Method App 20160064245 - SAITOH; Yusuke ;   et al. | 2016-03-03 |
Method of manufacturing semiconductor device Grant 9,230,824 - Takayama , et al. January 5, 2 | 2016-01-05 |
Method Of Manufacturing Semiconductor Device App 20150179466 - TAKAYAMA; Wataru ;   et al. | 2015-06-25 |
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