Takayama; Rie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takayama; Rie.The latest application filed is for "photosensitive adhesive resin composition, adhesive film and light-receiving device".

Company Profile

0.3.7

Takayama; Rie - Tokyo JP
Takayama; Rie - Utsunomiya JP
Takayama; Rie - Tochigi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing light receiving device Grant 8,268,540 - Takahashi , et al. September 18, 2	2012-09-18
Light receiving device and method of manufacturing light receiving device Grant 8,034,651 - Takahashi , et al. October 11, 2	2011-10-11
Resin composition, filling material, insulating layer and semiconductor device Grant 7,999,354 - Takahashi , et al. August 16, 2	2011-08-16
Photosensitive Adhesive Resin Composition, Adhesive Film And Light-receiving Device App 20100297439 - Takayama; Rie ; et al.	2010-11-25
Light Receiving Device And Method Of Manufacturing Light Receiving Device App 20100258713 - Takahashi; Toyosei ; et al.	2010-10-14
Process For Manufacturing Electronic Device App 20100193122 - Takahashi; Toyosei ; et al.	2010-08-05
Resin Composition, Filling Material, Insulating Layer And Semiconductor Device App 20100181684 - Takahashi; Toyosei ; et al.	2010-07-22
Process For Manufacturing Electronic Device App 20100183983 - Takayama; Rie ; et al.	2010-07-22
Resin Composition, Resin Spacer Film, And Semiconductor Device App 20100164126 - Takahashi; Toyosei ; et al.	2010-07-01
Method of manufacturing light receiving device App 20090226848 - Takahashi; Toyosei ; et al.	2009-09-10

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