loadpatents
name:-0.032624959945679
name:-0.022336006164551
name:-0.00058603286743164
Takaya; Minoru Patent Filings

Takaya; Minoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takaya; Minoru.The latest application filed is for "resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards".

Company Profile
0.20.23
  • Takaya; Minoru - Tokyo JP
  • Takaya; Minoru - Chiba JP
  • Takaya; Minoru - Ichikawa JP
  • Takaya; Minoru - Ichikawa-shi Chiba-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Module with embedded semiconductor IC and method of fabricating the module
Grant 7,547,975 - Takaya , et al. June 16, 2
2009-06-16
Method for manufacturing spherical ceramic powder
Grant 7,402,337 - Takaya , et al. July 22, 2
2008-07-22
Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
App 20080044660 - Takaya; Minoru ;   et al.
2008-02-21
Inductive device and method for producing the same
Grant 7,167,071 - Takaya , et al. January 23, 2
2007-01-23
Multilayer substrate and method for producing same
App 20060180342 - Takaya; Minoru ;   et al.
2006-08-17
Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
Grant 7,081,803 - Takaya , et al. July 25, 2
2006-07-25
Composite Magnetic Material And Magnetic Molding Material, Magnetic Powder Compression Molding Material, And Magnetic Paint Using The Composite Magnetic Material, Composite Dielectric Material And Molding Material, Powder Compression Molding Material, Paint, Prepreg, And Substrate Using The Composit
Grant 7,060,350 - Takaya , et al. June 13, 2
2006-06-13
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20050154110 - Takaya, Minoru ;   et al.
2005-07-14
Inductive device and method for producing the same
App 20050151613 - Takaya, Minoru ;   et al.
2005-07-14
Soldering flux, solder paste and method of soldering
Grant 6,915,944 - Takaya , et al. July 12, 2
2005-07-12
Composite Dielectric Material, Composite Dielectric Substrate, Prepreg, Coated Metal Foil, Molded Sheet, Composite Magnetic Substrate, Substrate, Double Side Metal Foil-clad Substrate, Flame Retardant Substrate, Polyvinylbenzyl Ether Resin Composition, Thermosettin
Grant 6,908,960 - Takaya , et al. June 21, 2
2005-06-21
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyviny
App 20050130447 - Takaya, Minoru ;   et al.
2005-06-16
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20050130446 - Takaya, Minoru ;   et al.
2005-06-16
Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element
Grant 6,872,251 - Takaya , et al. March 29, 2
2005-03-29
Method for manufacturing magnetic metal powder, and magnetic metal powder
App 20050056347 - Takaya, Minoru ;   et al.
2005-03-17
Module with embedded semiconductor IC and method of fabricating the module
App 20050029642 - Takaya, Minoru ;   et al.
2005-02-10
Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
App 20050003199 - Takaya, Minoru ;   et al.
2005-01-06
Electronic component and process for manufacturing the same
App 20040265551 - Takaya, Minoru ;   et al.
2004-12-30
Method for manufacturing magnetic metal powder, and magnetic metal powder
Grant 6,827,758 - Takaya , et al. December 7, 2
2004-12-07
Method for producing multilayer substrate and electronic part, and multilayer electronic part
Grant 6,808,642 - Takaya , et al. October 26, 2
2004-10-26
Electronic parts and method producing the same
App 20040202848 - Takaya, Minoru ;   et al.
2004-10-14
Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
App 20040183645 - Takaya, Minoru ;   et al.
2004-09-23
Single-crystal ferrite fine powder
Grant 6,793,842 - Akimoto , et al. September 21, 2
2004-09-21
Electronic parts and method producing the same
Grant 6,749,928 - Takaya , et al. June 15, 2
2004-06-15
Electronic parts
Grant 6,713,162 - Takaya , et al. March 30, 2
2004-03-30
Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
App 20030039101 - Takaya, Minoru ;   et al.
2003-02-27
Substrate for electronic part and electronic part
App 20030030994 - Takaya, Minoru ;   et al.
2003-02-13
Method for producing multilayer substrate and electronic part, and multilayer electronic part
App 20030029830 - Takaya, Minoru ;   et al.
2003-02-13
Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element
App 20020197461 - Takaya, Minoru ;   et al.
2002-12-26
Method for manufacturing magnetic metal powder, and magnetic metal powder
App 20020189401 - Takaya, Minoru ;   et al.
2002-12-19
Method for manufacturing spherical ceramic powder and spherical ceramic powder and composite material
App 20020193236 - Takaya, Minoru ;   et al.
2002-12-19
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo
App 20020132898 - Takaya, Minoru ;   et al.
2002-09-19
Electronic parts and method producing the same
App 20020122934 - Takaya, Minoru ;   et al.
2002-09-05
Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composit
App 20020039667 - Takaya, Minoru ;   et al.
2002-04-04
Single-crystal ferrite fine powder
App 20020017628 - Akimoto, Yuji ;   et al.
2002-02-14
Electronic parts
App 20020009577 - Takaya, Minoru ;   et al.
2002-01-24
Chip bead element and manufacturing method thereof
Grant 6,028,353 - Nakano , et al. February 22, 2
2000-02-22
Composite winding type stacked-layer inductors including self inductive inductors and manual-inductive inductors
Grant 5,530,415 - Takaya , et al. June 25, 1
1996-06-25
Method of making a multilayer hybrid circuit
Grant 5,428,885 - Takaya , et al. July 4, 1
1995-07-04
Multilayer hybrid circuit
Grant 5,225,969 - Takaya , et al. July 6, 1
1993-07-06
Laminated components of open magnetic circuit type
Grant 4,731,297 - Takaya March 15, 1
1988-03-15
Laminated hybrid integrated DC-DC converter
Grant 4,730,241 - Takaya March 8, 1
1988-03-08
Laminated electronic parts and process for making the same
Grant 4,322,698 - Takahashi , et al. March 30, 1
1982-03-30

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