Takatsuki; Ryo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takatsuki; Ryo.The latest application filed is for "fabrication method for integrated circuit chip component,multi-chip module, and their integration structure".

Company Profile

0.6.2

Takatsuki; Ryo - Usa JP
TAKATSUKI; RYO - Usa-shi JP
Takatsuki; Ryo - Oita-Ken JP
Takatsuki; Ryo - Ibaraki-ken JP
Takatsuki; Ryo - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure Grant 8,076,179 - Takatsuki December 13, 2	2011-12-13
Fabrication Method For Integrated Circuit Chip Component,multi-chip Module, And Their Integration Structure App 20110230011 - TAKATSUKI; RYO	2011-09-22
Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method Grant 7,977,801 - Takatsuki July 12, 2	2011-07-12
Integrated Circuit Chip Component, Multi-chip Module, Their Integration Structure, And Their Fabrication Method App 20090127716 - Takatsuki; Ryo	2009-05-21
Dual sided integrated circuit chip package with offset wire bonds and support block cavities Grant 5,545,922 - Golwalkar , et al. August 13, 1	1996-08-13
Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities Grant 5,527,740 - Golwalkar , et al. June 18, 1	1996-06-18
Method for constructing a dual sided, wire bonded integrated circuit chip package Grant 5,366,933 - Golwalkar , et al. November 22, 1	1994-11-22

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