Takashita; Hiromitsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takashita; Hiromitsu.The latest application filed is for "wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board".

Company Profile

0.14.14

Takashita; Hiromitsu - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method of molded article Grant 9,669,567 - Takeda , et al. June 6, 2	2017-06-06
Circuit board, and semiconductor device having component mounted on circuit board Grant 9,351,402 - Yoshioka , et al. May 24, 2	2016-05-24
Circuit board Grant 9,332,642 - Yoshioka , et al. May 3, 2	2016-05-03
Electronic components assembly Grant 9,204,530 - Takashita , et al. December 1, 2	2015-12-01
Resin composition and method for producing circuit board Grant 9,175,151 - Konno , et al. November 3, 2	2015-11-03
Wiring Method, Structure Having Wiring Provided On Surface, Semiconductor Device, Wiring Board, Memory Card, Electric Device, Module, And Multilayer Circuit Board App 20150271924 - YOSHIOKA; Shingo ; et al.	2015-09-24
Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board Grant 9,082,635 - Yoshioka , et al. July 14, 2	2015-07-14
Three-dimensional structure for wiring formation Grant 9,082,438 - Yoshioka , et al. July 14, 2	2015-07-14
Manufacturing method for semiconductor package, semiconductor package, and semiconductor device Grant 9,082,825 - Takashita , et al. July 14, 2	2015-07-14
Three-dimensional structure in which wiring is provided on its surface Grant 9,070,393 - Yoshioka , et al. June 30, 2	2015-06-30
Circuit Board, And Semiconductor Device Having Component Mounted On Circuit Board App 20150156873 - YOSHIOKA; Shingo ; et al.	2015-06-04
Manufacturing Method Of Molded Article App 20150035202 - TAKEDA; Tsuyoshi ; et al.	2015-02-05
Circuit Board App 20150034366 - YOSHIOKA; Shingo ; et al.	2015-02-05
Resin Composition And Method For Producing Circuit Board App 20150008379 - KONNO; Yuko ; et al.	2015-01-08
Circuit board, and semiconductor device having component mounted on circuit board Grant 8,929,092 - Yoshioka , et al. January 6, 2	2015-01-06
Resin composition and method for producing circuit board Grant 8,877,843 - Konno , et al. November 4, 2	2014-11-04
Manufacturing Method For Semiconductor Package, Semiconductor Package, And Semiconductor Device App 20140191406 - Takashita; Hiromitsu ; et al.	2014-07-10
Three-dimensional Structure For Wiring Formation App 20140182887 - YOSHIOKA; Shingo ; et al.	2014-07-03
Three-dimensional Structure In Which Wiring Is Provided On Its Surface App 20140183751 - YOSHIOKA; Shingo ; et al.	2014-07-03
Resin Composition And Method For Producing Circuit Board App 20130337188 - Konno; Yuko ; et al.	2013-12-19
Electronic Components Assembly App 20130265729 - TAKASHITA; Hiromitsu ; et al.	2013-10-10
Wiring Method, Structure Having Wiring Provided On Surface, Semiconductor Device, Wiring Board, Memory Card, Electric Device, Module And Multilayer Circuit Board App 20130056247 - Yoshioka; Shingo ; et al.	2013-03-07
Circuit Board, And Semiconductor Device Having Component Mounted On Circuit Board App 20120206891 - Yoshioka; Shingo ; et al.	2012-08-16

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