Takashima; Kouichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takashima; Kouichi.The latest application filed is for "semiconductor element mounting member, method of producing the same, and semiconductor device".

Company Profile

0.9.7

Takashima; Kouichi - Itami N/A JP
Takashima; Kouichi - Itami-shi JP
Takashima; Kouichi - Hyogo JP
Takashima; Kouichi - Osaka JP
Takashima; Kouichi - Ibaraki JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor element mounting member, method of producing the same, and semiconductor device Grant 8,575,625 - Takashima , et al. November 5, 2	2013-11-05
Semiconductor Element Mounting Member, Method Of Producing The Same, And Semiconductor Device App 20120292769 - Takashima; Kouichi ; et al.	2012-11-22
Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate Grant 8,178,893 - Takashima , et al. May 15, 2	2012-05-15
Heat spreader and semiconductor device using the same Grant 7,768,120 - Takashima August 3, 2	2010-08-03
Semiconductor Element Mounting Substrate, Semiconductor Device Using the Same, and Method for Manufacturing Semiconductor Element Mounting Substrate App 20090057705 - Takashima; Kouichi ; et al.	2009-03-05
Substrate for semiconductor device and semiconductor device Grant 7,470,982 - Takashima , et al. December 30, 2	2008-12-30
Heat spreader and method for manufacturing the same, and semiconductor device App 20080298024 - Takashima; Kouichi ; et al.	2008-12-04
Heat spreader and semiconductor device using the same App 20080157347 - Takashima; Kouichi	2008-07-03
Substrate for semiconductor device and semiconductor device App 20070194440 - Takashima; Kouichi ; et al.	2007-08-23
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor Grant 7,180,178 - Takashima , et al. February 20, 2	2007-02-20
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor Grant 6,979,901 - Takashima , et al. December 27, 2	2005-12-27
Semiconductor Heat-Dissipating Substrate, and Manufacturing Method and Package Therefor App 20050230819 - Takashima, Kouichi ; et al.	2005-10-20
Semicoductor radiating substrate and production method therefor and package App 20040135247 - Takashima, Kouichi ; et al.	2004-07-15
Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same Grant 6,077,360 - Takashima June 20, 2	2000-06-20
Hydraulically transported capsule Grant 4,066,298 - Sakamoto , et al. January 3, 1	1978-01-03

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