Takase; Yoshihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takase; Yoshihisa.The latest application filed is for "inductance part and electronic device using the same".

Company Profile

0.6.5

Takase; Yoshihisa - Higashiosaka JP
Takase, Yoshihisa - Higashiosaka-shi JP
Takase; Yoshihisa - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inductive components and electronic devices using the same Grant 7,212,094 - Matsutani , et al. May 1, 2	2007-05-01
Circuit board and its manufacturing method Grant 7,197,820 - Sugawa , et al. April 3, 2	2007-04-03
Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same Grant 7,151,228 - Takase , et al. December 19, 2	2006-12-19
Inductance part and electronic device using the same App 20050068150 - Matsutani, Nobuya ; et al.	2005-03-31
Electronic device Grant 6,791,818 - Shimoyama , et al. September 14, 2	2004-09-14
Method of manufacturing ceramic thick-film printed circuit board Grant 6,753,033 - Hashimoto , et al. June 22, 2	2004-06-22
It laminating double-side circuit board, and production method therefor and multilayer printed circuit board using App 20040104042 - Takase, Yoshihisa ; et al.	2004-06-03
Audio coding and decoding App 20040045738 - Sugawa, Toshio ; et al.	2004-03-11
Manufacturing Method Of Wiring Board, And Conductive Paste Used Therein App 20020056509 - MIURA, KAZUHIRO ; et al.	2002-05-16
Method of manufacturing ceramic thick-film printed circuit board App 20010029665 - Hashimoto, Akira ; et al.	2001-10-18
IC card and a method for the manufacture of the same Grant 5,208,450 - Uenishi , et al. May 4, 1	1993-05-04

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