| Patent | Date |
|---|
Resin-molding device and method for producing resin-molded product
Grant 10,814,532 - Okunishi , et al. October 27, 2 | 2020-10-27 |
Resin-molding Device And Method For Producing Resin-molded Product
App 20190001536 - OKUNISHI; Yoshito ; et al. | 2019-01-03 |
Supporting member separation method and supporting member separation apparatus
Grant 10,112,377 - Fujii , et al. October 30, 2 | 2018-10-30 |
Supporting member separation method
Grant 9,627,235 - Iwata , et al. April 18, 2 | 2017-04-18 |
Supporting member separation apparatus and supporting member separation method
Grant 9,238,357 - Takase , et al. January 19, 2 | 2016-01-19 |
Supporting Member Separation Method
App 20150325465 - Iwata; Yasumasa ; et al. | 2015-11-12 |
Supporting Member Separation Method And Supporting Member Separation Apparatus
App 20150083343 - Fujii; Yasushi ; et al. | 2015-03-26 |
Supporting Member Separation Apparatus And Supporting Member Separation Method
App 20140318714 - Takase; Shinji ; et al. | 2014-10-30 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
Grant 8,771,563 - Takase , et al. July 8, 2 | 2014-07-08 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
Grant 8,696,951 - Takase , et al. April 15, 2 | 2014-04-15 |
Optical electronic component
Grant 8,193,558 - Takase , et al. June 5, 2 | 2012-06-05 |
Method of resin-sealing and molding an optical device
Grant 7,985,357 - Takase , et al. July 26, 2 | 2011-07-26 |
Method for manufacturing optical electronic component
Grant 7,811,491 - Takase , et al. October 12, 2 | 2010-10-12 |
Method Of Forming Light Emitter And Molding Die
App 20100006215 - Kawakubo; Kazuki ; et al. | 2010-01-14 |
Method Of Resin Encapsulation Molding For Electronic Part
App 20090291532 - Takase; Shinji ; et al. | 2009-11-26 |
Resin sealing method for electronic part and mold used for the method
Grant 7,618,573 - Takase , et al. November 17, 2 | 2009-11-17 |
Optical Electronic Component
App 20090258189 - TAKASE; Shinji ; et al. | 2009-10-15 |
Semiconductor Chip Compression Molding Method And Mold For Compression Molding
App 20090189310 - Takase; Shinji ; et al. | 2009-07-30 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
App 20070138696 - Takase; Shinji ; et al. | 2007-06-21 |
Manufacturing method of optical electronic components and optical electronic components manufactured using the same
App 20070132135 - Takase; Shinji ; et al. | 2007-06-14 |
Resin-sealing and molding apparatus of optical device
App 20070110839 - Takase; Shinji ; et al. | 2007-05-17 |
Method of resin-sealing and molding an optical device
App 20070013090 - Takase; Shinji ; et al. | 2007-01-18 |
Resin sealing method for electronic part and mold used for the method
App 20060186576 - Takase; Shinji ; et al. | 2006-08-24 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
Grant 7,056,770 - Uragami , et al. June 6, 2 | 2006-06-06 |
Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
Grant 6,977,188 - Takase December 20, 2 | 2005-12-20 |
Method of resin-sealing and molding an optical device
App 20050242452 - Takase, Shinji ; et al. | 2005-11-03 |
Method of introducing resin for electronic component and apparatus used therefor
Grant 6,929,977 - Takase , et al. August 16, 2 | 2005-08-16 |
Fuel pressure regulating valve
Grant 6,752,170 - Muramatsu , et al. June 22, 2 | 2004-06-22 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
App 20040101631 - Uragami, Hiroshi ; et al. | 2004-05-27 |
Method of introducing resin for electronic component and apparatus used therefor
App 20040063234 - Takase, Shinji ; et al. | 2004-04-01 |
Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
App 20040048416 - Takase, Shinji | 2004-03-11 |
Electronic component, method of sealing electronic component with resin, and apparatus therefor
Grant 6,438,826 - Takase , et al. August 27, 2 | 2002-08-27 |
Fuel pressure regulating valve
App 20020092565 - Muramatsu, Toshihiko ; et al. | 2002-07-18 |
Electronic component, method of sealing electronic component with resin, and apparatus therefor
App 20010013424 - Takase, Shinji ; et al. | 2001-08-16 |
Catalyst for the hydrotreating of heavy hydrocarbon oils
Grant 4,595,667 - Takase , et al. June 17, 1 | 1986-06-17 |
Method for preparation of catalyst carriers
Grant 4,508,849 - Inoue , et al. April 2, 1 | 1985-04-02 |
Catalyst For The Conversion Of Hydrocarbon, A Method For The Preparation Of The Catalyst
Grant 3,872,029 - Takase , et al. * March 18, 1 | 1975-03-18 |
Method For Preparing Silica-alumina Catalysts For The Conversion Of Hydrocarbon
Grant 3,860,532 - Takase , et al. January 14, 1 | 1975-01-14 |
| 