Takase; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takase; Hideaki.The latest application filed is for "radiation sensitive resin composition and method of forming an interlayer insulating film".

Company Profile

0.14.18

Takase; Hideaki - Tokyo N/A JP
Takase; Hideaki - Chuo-ku JP
Takase; Hideaki - Ibaraki JP
Takase; Hideaki - Umezono JP
Takase, Hideaki - Tsukiji JP
Takase, Hideaki - Kingston CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Radiation sensitive resin composition and method of forming an interlayer insulating film Grant 8,563,214 - Kikuchi , et al. October 22, 2	2013-10-22
Positive-type radiation-sensitive composition, cured film, interlayer insulating film, method of forming interlayer insulating film, display device, and siloxane polymer for forming interlayer insulating film Grant 8,486,604 - Hanamura , et al. July 16, 2	2013-07-16
Radiation Sensitive Resin Composition And Method Of Forming An Interlayer Insulating Film App 20120270151 - Kikuchi; Katsuhiro ; et al.	2012-10-25
Positive-type Radiation-sensitive Composition, Cured Film, Interlayer Insulating Film, Method Of Forming Interlayer Insulating Film, Display Device, And Siloxane Polymer For Forming Interlayer Insulating Film App 20110008730 - HANAMURA; Masaaki ; et al.	2011-01-13
Resin Composition, Cured Product And Optical Parts App 20100137490 - Ueda; Mitsuru ; et al.	2010-06-03
Resin composition, cured product and optical parts Grant 7,714,096 - Ueda , et al. May 11, 2	2010-05-11
Resin Composition, Cured Product And Optical Parts App 20080255284 - Ueda; Mitsuru ; et al.	2008-10-16
Photosensitive resin composition for optical waveguide formation and optical waveguide Grant 7,394,965 - Utaka , et al. July 1, 2	2008-07-01
Photosensitive resin composition for optical waveguide formation and optical waveguide Grant 7,376,328 - Takase , et al. May 20, 2	2008-05-20
Optical waveguide chip and optical component comprising same Grant 7,366,381 - Tamaki , et al. April 29, 2	2008-04-29
Photosensitive Composition for Forming Optical Waveguide and Optical Waveguide App 20080015280 - Takase; Hideaki ; et al.	2008-01-17
Photosensitive Resin Composition for Optical Waveguide Formation and Optical Waveguide App 20070223868 - Utaka; Tomohiro ; et al.	2007-09-27
Method for manufacturing optical waveguide chip App 20070189671 - Tamaki; Kentarou ; et al.	2007-08-16
Polymer optical waveguide and optical device App 20070104439 - Tamaki; Kentarou ; et al.	2007-05-10
Radiation-curable composition, optical waveguide and method for formation thereof Grant 7,162,131 - Takase , et al. January 9, 2	2007-01-09
Curable liquid resin composition Grant 7,084,187 - Takase , et al. August 1, 2	2006-08-01
Radiation curable composition, optical waveguide and method for formation thereof App 20060165362 - Takase; Hideaki ; et al.	2006-07-27
Curable composition, cured product thereof, and laminated material Grant 7,060,737 - Yamaguchi , et al. June 13, 2	2006-06-13
Photosensitive resin composition for optical waveguide formation and optical wave guide App 20060008222 - Takase; Hideaki ; et al.	2006-01-12
Photocurable resin composition and optical material App 20050261392 - Futami, Satochi ; et al.	2005-11-24
Photocurable resin composition and optical component App 20050256219 - Takase, Hideaki ; et al.	2005-11-17
Curable liquid resin composition App 20050070623 - Takase, Hideaki ; et al.	2005-03-31
Curable composition, cured product thereof, and laminated material App 20040157972 - Yamaguchi, Yoshikazu ; et al.	2004-08-12
Photocurable resin composition and optical parts Grant 6,710,097 - Takase , et al. March 23, 2	2004-03-23
Photocurable resin composition and optical parts App 20030021943 - Takase, Hideaki ; et al.	2003-01-30
Photocurable adhesive for optical disk Grant 6,440,519 - Takase , et al. August 27, 2	2002-08-27
Photo-curable resin compositions and process for preparing a resin-based mold App 20020045126 - Watanabe, Tsuyoshi ; et al.	2002-04-18
Process for manufacturing information recording media and the information recording media App 20010046644 - Ukachi, Takashi ; et al.	2001-11-29
Liquid curable resin composition App 20010020049 - Takase, Hideaki ; et al.	2001-09-06
Resin composition and fibrous material forming mold Grant 6,013,714 - Haruta , et al. January 11, 2	2000-01-11

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