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Patent applications and USPTO patent grants for Takasago; Hayato.The latest application filed is for "rigid circuit board for liquid crystal display including cut out for providing flexibility to said board".
Patent | Date |
---|---|
Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board Grant 6,104,464 - Adachi , et al. August 15, 2 | 2000-08-15 |
Serial sampling video signal driving apparatus with improved color rendition Grant 5,604,513 - Takahashi , et al. February 18, 1 | 1997-02-18 |
Method for separating bonded substrates, in particular disassembling a liquid crystal display device Grant 5,269,868 - Gofuku , et al. December 14, 1 | 1993-12-14 |
Integrated circuit device having a metal substrate Grant 5,173,844 - Adachi , et al. December 22, 1 | 1992-12-22 |
Matrix-type color liquid crystal display device Grant 5,113,274 - Takahashi , et al. May 12, 1 | 1992-05-12 |
Multilayer interconnection circuit board Grant 5,034,569 - Gofuku , et al. July 23, 1 | 1991-07-23 |
Liquid crystal display device Grant 5,029,984 - Adachi , et al. July 9, 1 | 1991-07-09 |
Tape carrier for assembling an IC chip on a substrate Grant 4,967,261 - Niki , et al. October 30, 1 | 1990-10-30 |
Method for producing hybrid integrated circuit substrate Grant 4,963,389 - Takada , et al. October 16, 1 | 1990-10-16 |
Method for fabricating hybrid integrated circuit Grant 4,946,709 - Takada , et al. August 7, 1 | 1990-08-07 |
Testing device for electrical circuit boards Grant 4,943,768 - Niki , et al. * July 24, 1 | 1990-07-24 |
Method of packaging semiconductor device Grant 4,942,140 - Ootsuki , et al. July 17, 1 | 1990-07-17 |
Method for manufacturing hybrid integrated circuits Grant 4,914,815 - Takada , et al. April 10, 1 | 1990-04-10 |
Method for fabricating hybrid integrated circuit Grant 4,898,805 - Takada , et al. February 6, 1 | 1990-02-06 |
Screen printing apparatus Grant 4,854,230 - Niki , et al. August 8, 1 | 1989-08-08 |
Composite having conductive layer on resin layer and method of manufacturing Grant 4,645,734 - Takada , et al. February 24, 1 | 1987-02-24 |
Composite and circuit board having conductive layer on resin layer and method of manufacturing Grant 4,643,798 - Takada , et al. February 17, 1 | 1987-02-17 |
Method of manufacturing multilayer circuit board Grant 4,629,681 - Takada , et al. December 16, 1 | 1986-12-16 |
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