loadpatents
name:-0.00090408325195312
name:-0.019874095916748
name:-0.00043606758117676
Takasago; Hayato Patent Filings

Takasago; Hayato

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takasago; Hayato.The latest application filed is for "rigid circuit board for liquid crystal display including cut out for providing flexibility to said board".

Company Profile
0.18.0
  • Takasago; Hayato - Kikuchi-gun JP
  • Takasago; Hayato - Tokyo JP
  • Takasago; Hayato - Amagasaki JP
  • Takasago; Hayato - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board
Grant 6,104,464 - Adachi , et al. August 15, 2
2000-08-15
Serial sampling video signal driving apparatus with improved color rendition
Grant 5,604,513 - Takahashi , et al. February 18, 1
1997-02-18
Method for separating bonded substrates, in particular disassembling a liquid crystal display device
Grant 5,269,868 - Gofuku , et al. December 14, 1
1993-12-14
Integrated circuit device having a metal substrate
Grant 5,173,844 - Adachi , et al. December 22, 1
1992-12-22
Matrix-type color liquid crystal display device
Grant 5,113,274 - Takahashi , et al. May 12, 1
1992-05-12
Multilayer interconnection circuit board
Grant 5,034,569 - Gofuku , et al. July 23, 1
1991-07-23
Liquid crystal display device
Grant 5,029,984 - Adachi , et al. July 9, 1
1991-07-09
Tape carrier for assembling an IC chip on a substrate
Grant 4,967,261 - Niki , et al. October 30, 1
1990-10-30
Method for producing hybrid integrated circuit substrate
Grant 4,963,389 - Takada , et al. October 16, 1
1990-10-16
Method for fabricating hybrid integrated circuit
Grant 4,946,709 - Takada , et al. August 7, 1
1990-08-07
Testing device for electrical circuit boards
Grant 4,943,768 - Niki , et al. * July 24, 1
1990-07-24
Method of packaging semiconductor device
Grant 4,942,140 - Ootsuki , et al. July 17, 1
1990-07-17
Method for manufacturing hybrid integrated circuits
Grant 4,914,815 - Takada , et al. April 10, 1
1990-04-10
Method for fabricating hybrid integrated circuit
Grant 4,898,805 - Takada , et al. February 6, 1
1990-02-06
Screen printing apparatus
Grant 4,854,230 - Niki , et al. August 8, 1
1989-08-08
Composite having conductive layer on resin layer and method of manufacturing
Grant 4,645,734 - Takada , et al. February 24, 1
1987-02-24
Composite and circuit board having conductive layer on resin layer and method of manufacturing
Grant 4,643,798 - Takada , et al. February 17, 1
1987-02-17
Method of manufacturing multilayer circuit board
Grant 4,629,681 - Takada , et al. December 16, 1
1986-12-16

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