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name:-0.0055999755859375
name:-0.0081889629364014
name:-0.00063300132751465
Takaragi; Shigeru Patent Filings

Takaragi; Shigeru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takaragi; Shigeru.The latest application filed is for "ferrite particles for bonded magnet, resin composition for bonded magnet and molded products using the same".

Company Profile
0.9.4
  • Takaragi; Shigeru - Hiroshima-ken JP
  • Takaragi; Shigeru - Hiroshima JP
  • Takaragi, Shigeru - Hiroshima-shi JP
  • Takaragi; Shigeru - Otake JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ferrite particles for bonded magnet, resin composition for bonded magnet and molded products using the same
Grant 9,607,741 - Fujii , et al. March 28, 2
2017-03-28
Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product comprising the same
Grant 9,249,033 - Fujii , et al. February 2, 2
2016-02-02
Ferrite Particles For Bonded Magnet, Resin Composition For Bonded Magnet And Molded Products Using The Same
App 20140225023 - FUJII; Yasuhiko ;   et al.
2014-08-14
Ferrite particles for bonded magnet, resin composition for bonded magnet and molded products using the same
Grant 8,741,170 - Fujii , et al. June 3, 2
2014-06-03
Ferrite Particles For Bonded Magnets, Resin Composition For Bonded Magnets, And Molded Product Comprising The Same
App 20100108935 - Fujii; Yasuhiko ;   et al.
2010-05-06
Ferrite Particles For Bonded Magnet, Resin Composition For Bonded Magnet And Molded Products Using The Same
App 20100065771 - FUJII; Yasuhiko ;   et al.
2010-03-18
Resin composition for bonded magnet and bonded magnet using the same
Grant 6,787,059 - Takaragi , et al. September 7, 2
2004-09-07
Resin composition for bonded magnet and bonded magnet using the same
App 20030181631 - Takaragi, Shigeru ;   et al.
2003-09-25
Injection-molding apparatus and method of injection-molding
Grant 6,042,757 - Abe , et al. March 28, 2
2000-03-28
Resin-bonding method
Grant 5,123,989 - Horiishi , et al. June 23, 1
1992-06-23
Composite carrier particles for electrophotography and process for producing the same
Grant 5,108,862 - Kishimoto , et al. April 28, 1
1992-04-28

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