Takaoka; Hidekiyo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takaoka; Hidekiyo.The latest application filed is for "repair method and repair material".
Company Profile
4.37.39
- Takaoka; Hidekiyo - Nagaokakyo JP
- Takaoka; Hidekiyo - Nagaokakyo-shi JP
- Takaoka; Hidekiyo - Kyoto JP
- Takaoka; Hidekiyo - Omihachiman JP
- - Omihachiman JP
- TAKAOKA; Hidekiyo - Omihachiman-shi JP
- Takaoka; Hidekiyo - Omi-hachiman JP
- Takaoka; Hidekiyo - Shiga JP
- Takaoka; Hidekiyo - Kusatsu JP
- Takaoka; Hidekiyo - Kusatsu-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Repair method and repair material Grant 10,994,366 - Ishino , et al. May 4, 2 | 2021-05-04 |
| Method for joining structural material, joining sheet, and joint structure Grant 10,413,992 - Ishino , et al. Sept | 2019-09-17 |
| Repair Method And Repair Material App 20180369951 - Ishino; Satoshi ; et al. | 2018-12-27 |
| Method of forming solder bump, and solder bump Grant 10,090,268 - Sekimoto , et al. October 2, 2 | 2018-10-02 |
| Conductive material, bonding method using the same, and bonded structure Grant 10,050,355 - Nakano , et al. August 14, 2 | 2018-08-14 |
| Solder paste, joining method using the same and joined structure Grant 10,010,980 - Nakano , et al. July 3, 2 | 2018-07-03 |
| Electronic part and method for forming joint structure of electronic part and joining object Grant 9,691,546 - Takaoka , et al. June 27, 2 | 2017-06-27 |
| Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part Grant 9,614,295 - Nakano , et al. April 4, 2 | 2017-04-04 |
| Electronic device, bonding material, and method for producing electronic device Grant 9,572,255 - Nomura , et al. February 14, 2 | 2017-02-14 |
| Method For Joining Structural Material, Joining Sheet, And Joint Structure App 20160297029 - Ishino; Satoshi ; et al. | 2016-10-13 |
| Repair Method And Repair Material App 20160288245 - lshino; Satoshi ; et al. | 2016-10-06 |
| Electronic part Grant 9,412,517 - Takaoka , et al. August 9, 2 | 2016-08-09 |
| Electronic component module Grant 9,414,513 - Nakagoshi , et al. August 9, 2 | 2016-08-09 |
| Joining method, method for producing electronic device and electronic part Grant 9,409,247 - Nakano , et al. August 9, 2 | 2016-08-09 |
| Ceramic multilayer substrate and method for producing the same Grant 9,370,111 - Okada , et al. June 14, 2 | 2016-06-14 |
| Joining method, joint structure and method for producing the same Grant 9,333,593 - Nakano , et al. May 10, 2 | 2016-05-10 |
| Joining Method, Joint Structure, Electronic Device, Method For Manufacturing Electronic Device And Electronic Part App 20160043480 - Nakano; Kosuke ; et al. | 2016-02-11 |
| Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part Grant 9,209,527 - Nakano , et al. December 8, 2 | 2015-12-08 |
| Method of Forming Solder Bump, and Solder Bump App 20150333027 - Sekimoto; Yasuyuki ; et al. | 2015-11-19 |
| Solder paste and solder joint Grant 9,162,324 - Nakano , et al. October 20, 2 | 2015-10-20 |
| Solder Paste, Joining Method Using The Same And Joined Structure App 20150239069 - Nakano; Kosuke ; et al. | 2015-08-27 |
| Electronic component module and method for manufacturing the same Grant 9,113,571 - Nakagoshi , et al. August 18, 2 | 2015-08-18 |
| Connection structure Grant 9,105,987 - Nakano , et al. August 11, 2 | 2015-08-11 |
| Solder paste, joining method using the same and joined structure Grant 9,044,816 - Nakano , et al. June 2, 2 | 2015-06-02 |
| Electronic Component Module App 20150103495 - Nakagoshi; Hideo ; et al. | 2015-04-16 |
| Bonding Member App 20150072165 - Sunaga; Tomohiro ; et al. | 2015-03-12 |
| Circuit board Grant 8,975,527 - Takaoka March 10, 2 | 2015-03-10 |
| Electronic Part And Method For Forming Joint Structure Of Electronic Part And Joining Object App 20150034701 - Takaoka; Hidekiyo ; et al. | 2015-02-05 |
| Solder paste and electronic device Grant 8,920,580 - Takaoka , et al. December 30, 2 | 2014-12-30 |
| Solder paste and electronic device Grant 08920580 - | 2014-12-30 |
| Joining Method, Joint Structure And Method For Producing The Same App 20140363221 - Nakano; Kosuke ; et al. | 2014-12-11 |
| Joining Method, Joint Structure And Method For Producing The Same App 20140356055 - Nakano; Kosuke ; et al. | 2014-12-04 |
| Joining Method, Method For Producing Electronic Device And Electronic Part App 20140345939 - Nakano; Kosuke ; et al. | 2014-11-27 |
| Electronic Part App 20140340816 - Takaoka; Hidekiyo ; et al. | 2014-11-20 |
| Ceramic Multilayer Substrate And Method For Producing The Same App 20140312539 - OKADA; Yoshiko ; et al. | 2014-10-23 |
| Ceramic multilayer substrate and method for producing the same Grant 8,802,998 - Okada , et al. August 12, 2 | 2014-08-12 |
| Electronic Device, Bonding Material, And Method For Producing Electronic Device App 20140218886 - Nomura; Akihiro ; et al. | 2014-08-07 |
| Electroconductive Material, And Connection Method And Connection Structure Using The Same App 20140193650 - Nakano; Kosuke ; et al. | 2014-07-10 |
| Electroconductive Material, And Connection Method And Connection Structure Using The Same App 20140178703 - Nakano; Kosuke ; et al. | 2014-06-26 |
| Electronic Component Module And Method For Manufacturing The Same App 20130343023 - NAKAGOSHI; Hideo ; et al. | 2013-12-26 |
| Joining Method, Joint Structure, Electronic Device, Method For Manufacturing Electronic Device And Electronic Part App 20130299236 - Nakano; Kosuke ; et al. | 2013-11-14 |
| Connection Structure App 20130270001 - Nakano; Kosuke ; et al. | 2013-10-17 |
| Conductive Material, Bonding Method Using The Same, And Bonded Structure App 20130233618 - Nakano; Kosuke ; et al. | 2013-09-12 |
| Circuit Board App 20120186860 - TAKAOKA; Hidekiyo | 2012-07-26 |
| Lead-free solder paste and its use Grant 8,227,536 - Watanabe , et al. July 24, 2 | 2012-07-24 |
| Electroconductive bonding material and electronic apparatus Grant 8,222,751 - Nomura , et al. July 17, 2 | 2012-07-17 |
| Solder Paste, Joining Method Using the Same and Joined Structure App 20120156512 - Nakano; Kosuke ; et al. | 2012-06-21 |
| Electroconductive bonding material and electronic apparatus Grant 8,105,687 - Nomura , et al. January 31, 2 | 2012-01-31 |
| Electroconductive Bonding Material and Electronic Apparatus App 20110067912 - Nomura; Akhiro ; et al. | 2011-03-24 |
| Piezoelectric actuator Grant 7,777,398 - Takei , et al. August 17, 2 | 2010-08-17 |
| Ceramic Multilayer Substrate And Method For Producing The Same App 20100155118 - OKADA; Yoshiko ; et al. | 2010-06-24 |
| Lead-Free Solder Paste and Its Use App 20100035072 - Watanabe; Shizuharu ; et al. | 2010-02-11 |
| Solder Paste and Solder Joint App 20090301607 - Nakano; Kosuke ; et al. | 2009-12-10 |
| Electroconductive Bonding Material and Electronic Apparatus App 20090155608 - Nomura; Akihiro ; et al. | 2009-06-18 |
| Lead-free solder and soldered article Grant 7,488,445 - Takaoka , et al. February 10, 2 | 2009-02-10 |
| Lead-free solder and soldered article Grant 7,422,721 - Takaoka , et al. September 9, 2 | 2008-09-09 |
| Lead-free solder and soldered article App 20080070059 - Takaoka; Hidekiyo ; et al. | 2008-03-20 |
| Piezoelectric Actuator App 20080007144 - Takei; Shodo ; et al. | 2008-01-10 |
| Solder paste and electronic device App 20070245852 - Takaoka; Hidekiyo ; et al. | 2007-10-25 |
| Thick film electrode and multilayer ceramic electronic device Grant 7,276,841 - Takaoka , et al. October 2, 2 | 2007-10-02 |
| Lead-free solder and soldered article App 20060285994 - Takaoka; Hidekiyo ; et al. | 2006-12-21 |
| Thick Film Electrode And Multilayer Ceramic Electronic Device App 20060232170 - Takaoka; Hidekiyo ; et al. | 2006-10-19 |
| Lead-free solder and soldered article Grant 7,022,282 - Takaoka , et al. April 4, 2 | 2006-04-04 |
| Pb-free solder composition and soldered article App 20040096632 - Takaoka, Hidekiyo ; et al. | 2004-05-20 |
| Pb-free solder composition and soldered article Grant 6,703,113 - Takaoka , et al. March 9, 2 | 2004-03-09 |
| Lead free solder and soldered article Grant 6,660,226 - Takaoka , et al. December 9, 2 | 2003-12-09 |
| Ceramic electronic component Grant 6,614,641 - Kayatani , et al. September 2, 2 | 2003-09-02 |
| Ceramic electronic component App 20030037962 - Kayatani, Takayuki ; et al. | 2003-02-27 |
| Lead-free solder and soldered article App 20020192106 - Takaoka, Hidekiyo ; et al. | 2002-12-19 |
| Lead-free solder and soldered article App 20020131887 - Takaoka, Hidekiyo ; et al. | 2002-09-19 |
| Lead-free solder and soldered article App 20020127136 - Takaoka, Hidekiyo ; et al. | 2002-09-12 |
| Pb-free solder composition and soldered article App 20020012608 - Takaoka, Hidekiyo ; et al. | 2002-01-31 |
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