Takano; Takahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takano; Takahiro.The latest application filed is for "wired circuit board and production method thereof".

Company Profile

4.25.39

Takano; Takahiro - Osaka JP
Takano; Takahiro - Hiratsuka JP
Takano; Takahiro - Rochester NY
Takano; Takahiro - Kanagawa JP
TAKANO; Takahiro - Hiratsuka-shi JP
Takano; Takahiro - Wakayama JP
Takano; Takahiro - Wakayama-shi JP
Takano; Takahiro - Kanagawa-ken JP
Takano; Takahiro - Yamanashi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Producing method of wiring circuit board and wiring circuit board assembly sheet Grant 11,369,024 - Takano , et al. June 21, 2	2022-06-21
Wiring circuit board Grant 11,337,302 - Shibata , et al. May 17, 2	2022-05-17
Wired circuit board and production method thereof Grant 11,266,024 - Shibata , et al. March 1, 2	2022-03-01
Wired Circuit Board And Production Method Thereof App 20210243900 - SHIBATA; Shusaku ; et al.	2021-08-05
Imaging element mounting board, producing method of imaging element mounting board, and mounting board assembly Grant 11,081,437 - Shibata , et al. August 3, 2	2021-08-03
Wiring Circuit Board App 20210204398 - SHIBATA; Shusaku ; et al.	2021-07-01
Producing Method Of Wiring Circuit Board And Wiring Circuit Board Sheet App 20210195757 - MINATOYA; Takahiro ; et al.	2021-06-24
Wired circuit board and production method thereof Grant 11,032,913 - Shibata , et al. June 8, 2	2021-06-08
Producing Method Of Wiring Circuit Board And Wiring Circuit Board Assembly Sheet App 20210144859 - TAKANO; Takahiro ; et al.	2021-05-13
Pressure-sensitive Adhesive Sheet-including Wiring Circuit Board And Producing Method Thereof App 20210127499 - TAKANO; Takahiro ; et al.	2021-04-29
Polyamide resin composition and molded article Grant 10,988,615 - Yamada , et al. April 27, 2	2021-04-27
Wired Circuit Board And Production Method Thereof App 20200344888 - SHIBATA; Shusaku ; et al.	2020-10-29
Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part Grant 10,815,377 - Yamada , et al. October 27, 2	2020-10-27
Elimination of chronic pain by chronic activation of adenosine receptor type A1 in peripheral sensory neurons App 20200276312 - Takano; Takahiro ; et al.	2020-09-03
Crystallizable thermoplastic resin composition and molded article Grant 10,619,031 - Takano , et al.	2020-04-14
Imaging Element Mounting Board, Producing Method Of Imaging Element Mounting Board, And Mounting Board Assembly App 20200105656 - SHIBATA; Shusaku ; et al.	2020-04-02
Polyamide Resin Composition And Molded Article App 20190077957 - YAMADA; Ryusuke ; et al.	2019-03-14
Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer Grant 10,148,006 - Takano , et al. De	2018-12-04
Resin Composition, Resin Molding, Method For Manufacturing Plated Resin Molding, And Method For Manufacturing Antenna-equipped Portable Electronic Device Part App 20180298190 - YAMADA; Ryusuke ; et al.	2018-10-18
Suspension board with circuit and producing method thereof Grant 10,034,388 - Sakakura , et al. July 24, 2	2018-07-24
Suspension Board With Circuit And Producing Method Thereof App 20180070457 - SAKAKURA; Takatoshi ; et al.	2018-03-08
Suspension Board With Circuit And Producing Method Thereof App 20170330590 - OKUNO; Tomoaki ; et al.	2017-11-16
Wired Circuit Board And Producing Method Thereof, And Wired Circuit Board Assembly And Producing Method Thereof App 20170318676 - TAKANO; Takahiro ; et al.	2017-11-02
Wired Circuit Board App 20170229635 - TAKANO; Takahiro ; et al.	2017-08-10
Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer Grant 9,587,316 - Takano , et al. March 7, 2	2017-03-07
Processes For Manufacturing Resin Molded Articles App 20160298242 - MORIMOTO; Kei ; et al.	2016-10-13
Thermoplastic Resin Composition, Resin Molded Article, And Method For Manufacturing The Resin Molded Article With Plating Layer App 20160215124 - TAKANO; Takahiro ; et al.	2016-07-28
Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer Grant 9,365,693 - Takano , et al. June 14, 2	2016-06-14
Crystallizable Thermoplastic Resin Composition And Molded Article App 20160145419 - TAKANO; Takahiro ; et al.	2016-05-26
Wired Circuit Board And Producing Method Thereof, And Wired Circuit Board Assembly And Producing Method Thereof App 20160135296 - TAKANO; Takahiro ; et al.	2016-05-12
Polyamide resin moldings Grant 9,334,365 - Mitadera , et al. May 10, 2	2016-05-10
Thermoplastic Resin Composition, Resin Molded Article, And Method For Manufacturing Resin Molded Article Having A Plated Layer App 20150353714 - TAKANO; Takahiro ; et al.	2015-12-10
Thermoplastic Resin Composition, Resin Molded Article, And Method For Manufacturing Resin Molded Article Having A Plated Layer App 20150247243 - Takano; Takahiro ; et al.	2015-09-03
Thermoplastic Resin Composition, Resin Molded Article, And Method For Manufacturing Resin Molded Article Having A Plated Layer App 20150244066 - Takano; Takahiro ; et al.	2015-08-27
Thin-wall article Grant 9,096,714 - Mitadera , et al. August 4, 2	2015-08-04
Polyamide Resin Composition For Portable Electronic Device And Molded Article For Portable Electronic Device App 20150080516 - KUMAZAWA; Teruhisa ; et al.	2015-03-19
Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer Grant 8,933,161 - Takano , et al. January 13, 2	2015-01-13
Thin-wall Article App 20140194569 - Mitadera; Jun ; et al.	2014-07-10
Thermoplastic Resin Composition, Resin Article, And Method Of Manufacturing Resin Article With Plated Layer App 20140147682 - Takano; Takahiro ; et al.	2014-05-29
Thermoplastic Resin Composition, Resin Molded Article, And Method Of Manufacturing Resin Molded Article With Plated Layer App 20140002311 - Takano; Takahiro ; et al.	2014-01-02
Polyamide resin compositions Grant 8,603,600 - Mitadera , et al. December 10, 2	2013-12-10
Polyamide Resin Moldings App 20130172460 - Mitadera; Jun ; et al.	2013-07-04
Polyamide Resin Compositions App 20130078402 - Mitadera; Jun ; et al.	2013-03-28
Threaded joint for steel pipes Grant 8,038,179 - Takano , et al. October 18, 2	2011-10-18
Threaded Joint For Steel Pipes App 20100270793 - Takano; Takahiro ; et al.	2010-10-28
Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device App 20100227122 - Kumazawa; Teruhisa ; et al.	2010-09-09
Surface conditioning prior to chemical conversion treatment of a steel member Grant 7,666,266 - Izawa , et al. February 23, 2	2010-02-23
Treatment And Prevention Of Epilepsy App 20100029613 - Nedergaard; Maiken ; et al.	2010-02-04
Thread protector for a pipe Grant 7,469,721 - Takano December 30, 2	2008-12-30
Method for surface treatment of metal pipes Grant 7,244,471 - Takano , et al. July 17, 2	2007-07-17
Surface conditioning prior to chemical conversion treatment of a steel member App 20070056656 - Izawa; Masaru ; et al.	2007-03-15
Manufacturing method of martensite stainless seamless steel pipe App 20070006946 - Takano; Takahiro	2007-01-11
Thread protector for a pipe App 20060042709 - Takano; Takahiro	2006-03-02
Method and apparatus for surface treatment of metal pipes App 20050147760 - Takano, Takahiro ; et al.	2005-07-07
Interlock device Grant 6,784,387 - Takano August 31, 2	2004-08-31
Polyamide resin composition App 20020040087 - Yamamoto, Koji ; et al.	2002-04-04

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