Takano; Ryuichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takano; Ryuichi.The latest application filed is for "die bonder and bonding method".
- Takano; Ryuichi - Kumagaya JP
- Takano; Ryuichi - Tokyo JP
- TAKANO; Ryuichi - Kumagaya-shi JP
| Patent | Date |
|---|---|
| Die bonder and bonding method Grant 9,362,250 - Takano , et al. June 7, 2 | 2016-06-07 |
| Foreign substance removing device and die bonder equipped with the same Grant 8,783,319 - Yamagami , et al. July 22, 2 | 2014-07-22 |
| Fabrication method of semiconductor device Grant 8,703,583 - Maki , et al. April 22, 2 | 2014-04-22 |
| Die Bonder And Bonding Method App 20140069564 - TAKANO; Ryuichi ; et al. | 2014-03-13 |
| Foreign Substance Removing Device and Die Bonder Equipped with the Same App 20120241096 - YAMAGAMI; Takashi ; et al. | 2012-09-27 |
| Fabrication Method of Semiconductor Device App 20100055878 - MAKI; Hiroshi ; et al. | 2010-03-04 |
| Fabrication method of semiconductor device Grant 7,629,231 - Maki , et al. December 8, 2 | 2009-12-08 |
| Fabrication Method Of Semiconductor Device App 20070275544 - Maki; Hiroshi ; et al. | 2007-11-29 |
| Light valve device Grant 6,067,062 - Takasu , et al. May 23, 2 | 2000-05-23 |
| Semiconductor thin film formed on a supporting substrate Grant 5,646,432 - Iwaki , et al. July 8, 1 | 1997-07-08 |
| Light valve device making Grant 5,637,187 - Takasu , et al. June 10, 1 | 1997-06-10 |
| Semiconductor substrate having a thin film semiconductor layer bonded on a support substrate through an adhesive layer Grant 5,459,335 - Matsushita , et al. October 17, 1 | 1995-10-17 |
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