Takano; Akihito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takano; Akihito.The latest application filed is for "semiconductor package".

Company Profile

0.15.15

Takano; Akihito - Nagano-ken N/A JP
Takano; Akihito - Nagano N/A JP
TAKANO; Akihito - Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring board, semiconductor device, and method for manufacturing wiring board Grant 8,810,007 - Takano , et al. August 19, 2	2014-08-19
Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate Grant 8,766,101 - Miyairi , et al. July 1, 2	2014-07-01
Semiconductor Package App 20140151891 - TAKANO; Akihito ; et al.	2014-06-05
Wiring board, semiconductor device, and method for manufacturing wiring board Grant 8,669,643 - Takano , et al. March 11, 2	2014-03-11
Wiring substrate and method for manufacturing the wiring substrate Grant 8,446,013 - Sunohara , et al. May 21, 2	2013-05-21
Wiring Substrate, Method For Manufacturing Wiring Substrate, And Semiconductor Package Including Wiring Substrate App 20130056251 - Miyairi; Ken ; et al.	2013-03-07
Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board App 20120261801 - TAKANO; Akihito ; et al.	2012-10-18
Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board App 20120261832 - TAKANO; Akihito ; et al.	2012-10-18
Stacked semiconductor device and method of manufacturing the same Grant 8,101,461 - Takano , et al. January 24, 2	2012-01-24
Wiring Substrate And Method For Manufacturing The Wiring Substrate App 20110316169 - SUNOHARA; Masahiro ; et al.	2011-12-29
Laminated body of semiconductor chips including pads mutually connected to conductive member Grant 8,058,717 - Takano November 15, 2	2011-11-15
Semiconductor Chip Laminated Body App 20100320584 - TAKANO; Akihito	2010-12-23
Semiconductor Device And Method Of Manufacturing The Same App 20100148340 - TAKANO; Akihito ; et al.	2010-06-17
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method Grant 7,358,591 - Horikawa , et al. April 15, 2	2008-04-15
Method of manufacturing an electronic parts packaging structure Grant 7,319,049 - Oi , et al. January 15, 2	2008-01-15
Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element Grant 7,161,242 - Yamasaki , et al. January 9, 2	2007-01-09
Electronic part-containing elements, electronic devices and production methods App 20060017133 - Oi; Kiyoshi ; et al.	2006-01-26
Method of manufacturing an electronic parts packaging structure App 20050247665 - Oi, Kiyoshi ; et al.	2005-11-10
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method App 20050199929 - Horikawa, Yasuyoshi ; et al.	2005-09-15
Multilayer circuit board and semiconductor device using the same Grant 6,891,732 - Takano , et al. May 10, 2	2005-05-10
Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element App 20040183187 - Yamasaki, Tomoo ; et al.	2004-09-23
Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated Grant 6,754,952 - Takano , et al. June 29, 2	2004-06-29
Semiconductor device and method for manufacturing same App 20030094686 - Iijima, Takahiro ; et al.	2003-05-22
Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated App 20030088978 - Takano, Akihito ; et al.	2003-05-15
Multilayer circuit board and semiconductor device using the same App 20030058630 - Takano, Akihito ; et al.	2003-03-27

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