Takamatsu; Yasushi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takamatsu; Yasushi.The latest application filed is for "polymerizable epoxy composition, and sealing material composition comprising the same".
- Takamatsu; Yasushi - Funabashi JP
- Takamatsu; Yasushi - Chiba JP
- Takamatsu; Yasushi - Yokohama JP
- Takamatsu; Yasushi - Yokahama JP
- Takamatsu, Yasushi - Sodegaura-shi JP
| Patent | Date |
|---|---|
| Polymerizable epoxy composition, and sealing material composition comprising the same Grant 8,889,803 - Takamatsu , et al. November 18, 2 | 2014-11-18 |
| Polymerizable Epoxy Composition, And Sealing Material Composition Comprising The Same App 20110001419 - Takamatsu; Yasushi ; et al. | 2011-01-06 |
| Microprocessor system App 20070260784 - Takamatsu; Yasushi ; et al. | 2007-11-08 |
| Photocurable resin composition for sealing material and method of sealing Grant 6,586,496 - Takamatsu , et al. July 1, 2 | 2003-07-01 |
| Photocationic-curable resin composition and uses thereof App 20030062125 - Takamatsu, Yasushi ; et al. | 2003-04-03 |
| Ink composition for ink jet recording Grant 6,271,285 - Miyabayashi , et al. August 7, 2 | 2001-08-07 |
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