TAKAKURA; Hayato

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKAKURA; Hayato.The latest application filed is for "wired circuit board, casing, and board containing set".

Company Profile

9.9.17

TAKAKURA; Hayato - Osaka JP
Takakura; Hayato - Ibaraki JP
TAKAKURA; Hayato - Ibaraki-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wired Circuit Board, Casing, And Board Containing Set App 20220287177 - TAKAKURA; Hayato ; et al.	2022-09-08
Wiring Circuit Board App 20220256712 - TAKIMOTO; Kenya ; et al.	2022-08-11
Wiring Circuit Board App 20220201871 - TAKIMOTO; Kenya ; et al.	2022-06-23
Wiring Circuit Board And Producing Method Thereof App 20220192010 - SASAOKA; Ryosuke ; et al.	2022-06-16
Wiring circuit board and producing method thereof Grant 11,297,711 - Kawamura , et al. April 5, 2	2022-04-05
Wired circuit board and production method thereof Grant 11,266,024 - Shibata , et al. March 1, 2	2022-03-01
Wiring Circuit Board And Producing Method Thereof App 20220007507 - FUKUSHIMA; Rihito ; et al.	2022-01-06
Wiring circuit board and imaging device Grant 11,183,448 - Takakura , et al. November 23, 2	2021-11-23
Wired Circuit Board, Producing Method Thereof, And Imaging Device App 20210298175 - SHIBATA; Shusaku ; et al.	2021-09-23
Flexible wiring circuit board and imaging device Grant 11,122,676 - Takakura , et al. September 14, 2	2021-09-14
Wired Circuit Board And Production Method Thereof App 20210243900 - SHIBATA; Shusaku ; et al.	2021-08-05
Imaging element mounting board, producing method of imaging element mounting board, and mounting board assembly Grant 11,081,437 - Shibata , et al. August 3, 2	2021-08-03
Method of producing a wired circuit board Grant 11,058,002 - Shibata , et al. July 6, 2	2021-07-06
Imaging Element-mounting Board App 20210195070 - SHIBATA; Shusaku ; et al.	2021-06-24
Wired circuit board and production method thereof Grant 11,032,913 - Shibata , et al. June 8, 2	2021-06-08
Wiring Circuit Board And Producing Method Thereof App 20210084750 - KAWAMURA; Yoshihiro ; et al.	2021-03-18
Wired Circuit Board And Production Method Thereof App 20200344888 - SHIBATA; Shusaku ; et al.	2020-10-29
Flexible wiring circuit board, producing method thereof, and imaging device Grant 10,813,221 - Shibata , et al. October 20, 2	2020-10-20
Wired Circuit Board, Producing Method Thereof, And Imaging Device App 20200288575 - SHIBATA; Shusaku ; et al.	2020-09-10
Flexible Wiring Circuit Board And Imaging Device App 20200154016 - TAKAKURA; Hayato ; et al.	2020-05-14
Imaging Element Mounting Board, Producing Method Of Imaging Element Mounting Board, And Mounting Board Assembly App 20200105656 - SHIBATA; Shusaku ; et al.	2020-04-02
Wiring Circuit Board And Imaging Device App 20200075474 - TAKAKURA; Hayato ; et al.	2020-03-05
Flexible Wiring Circuit Board, Producing Method Thereof, And Imaging Device App 20200077520 - SHIBATA; Shusaku ; et al.	2020-03-05
Printed circuit board and method of manufacturing same Grant 9,173,301 - Takakura October 27, 2	2015-10-27
Printed Circuit Board And Method Of Manufacturing Same App 20150027752 - TAKAKURA; Hayato	2015-01-29
Plating Apparatus, Plating Method, Method Of Manufacturing Printed Circuit Board And Printed Circuit Board App 20140311776 - TAKAKURA; Hayato	2014-10-23

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