Takai; Keiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takai; Keiji.The latest application filed is for "lead frame and intermediate product of semiconductor device".

Company Profile

0.7.3

Takai; Keiji - Kitakyushu JP
Takai; Keiji - Fukuoka JP
TAKAI; Keiji - Kitakyushu-shi JP
Takai; Keiji - Tokyo JP
Takai; Keiji - Nara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame and intermediate product of semiconductor device Grant 8,258,608 - Takai September 4, 2	2012-09-04
Semiconductor device and manufacturing method thereof Grant 8,003,444 - Takai , et al. August 23, 2	2011-08-23
Lead Frame And Intermediate Product Of Semiconductor Device App 20110095405 - TAKAI; Keiji	2011-04-28
Semiconductor device and manufacturing method thereof App 20070181983 - Takai; Keiji ; et al.	2007-08-09
Wire-winding machine and a wire-winding method for making windings of a rotary electromechanical device Grant 6,659,385 - Akita , et al. December 9, 2	2003-12-09
Wire-winding machine and a wire-winding method for making windings of a rotary electromechanical device App 20020050541 - Akita, Hiroyuki ; et al.	2002-05-02
Solder-ball connected semiconductor device with a recessed chip mounting area Grant 5,717,252 - Nakashima , et al. February 10, 1	1998-02-10
Process for manufacturing a plurality of strip lead frame semiconductor devices Grant 5,661,086 - Nakashima , et al. August 26, 1	1997-08-26
Method of producing a frame made of connected semiconductor die mounting substrates Grant 5,614,443 - Nakashima , et al. March 25, 1	1997-03-25
7-Acylaminocephalosporanic acid derivatives Grant 4,477,447 - Ueda , et al. October 16, 1	1984-10-16

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