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Patent applications and USPTO patent grants for Takahashi; Tokuji.The latest application filed is for "apparatus and method for measuring thickness of thin semiconductor multi-layer film".
Patent | Date |
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Apparatus and method for measuring thickness of thin semiconductor multi-layer film Grant 5,587,792 - Nishizawa , et al. December 24, 1 | 1996-12-24 |
Subframe assembly for vehicle Grant 5,542,707 - Kamei , et al. August 6, 1 | 1996-08-06 |
Method and apparatus for measuring the thicknesses of layers of a multiple layer semiconductor film utilizing the comparison between a spatialgram and an optical characteristic matrix Grant 5,523,840 - Nishizawa , et al. June 4, 1 | 1996-06-04 |
Optical apparatus components having spectrally overlapping characteristics for measuring semiconductor layer thickness Grant 5,371,596 - Hattori , et al. December 6, 1 | 1994-12-06 |
Inspection apparatus for automatically detecting the unevenness or the flaws of a coating Grant 4,110,047 - Takahashi August 29, 1 | 1978-08-29 |
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