TAKAHASHI; Nobuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKAHASHI; Nobuya.The latest application filed is for "coil component and its manufacturing method".

Company Profile

0.16.14

TAKAHASHI; Nobuya - Tokyo JP
Takahashi; Nobuya - Ogaki JP
TAKAHASHI; Nobuya - Ogaki-shi JP
Takahashi; Nobuya - Gifu JP
Takahashi; Nobuya - Kobe JP
Takahashi; Nobuya - Ayabe JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coil Component And Its Manufacturing Method App 20210233698 - TAKAHASHI; Nobuya ; et al.	2021-07-29
Coil component Grant 10,840,010 - Fujii , et al. November 17, 2	2020-11-17
Coil Component And Manufacturing Method Therefor App 20190244750 - SUZUKI; Masanori ; et al.	2019-08-08
Coil Component App 20180323003 - FUJII; Naoaki ; et al.	2018-11-08
Printed wiring board Grant 9,736,945 - Takahashi August 15, 2	2017-08-15
Printed wiring board and method for manufacturing the same Grant 9,711,439 - Sakamoto , et al. July 18, 2	2017-07-18
Electronic component having encapsulated wiring board and method for manufacturing the same Grant 9,536,801 - Furutani , et al. January 3, 2	2017-01-03
Wiring board and method for manufacturing the same Grant 9,480,157 - Shizuno , et al. October 25, 2	2016-10-25
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device Grant 9,338,886 - Furutani , et al. May 10, 2	2016-05-10
Printed Wiring Board And Method For Manufacturing The Same App 20160066423 - SAKAMOTO; Hajime ; et al.	2016-03-03
Printed Wiring Board App 20160037629 - TAKAHASHI; Nobuya	2016-02-04
Electronic Component Having Encapsulated Wiring Board And Method For Manufacturing The Same App 20150255359 - FURUTANI; Toshiki ; et al.	2015-09-10
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20150245485 - TAKAHASHI; Nobuya ; et al.	2015-08-27
Wiring Board And Method For Manufacturing The Same App 20150216049 - SHIZUNO; Yoshinori ; et al.	2015-07-30
Electronic component having encapsulated wiring board and method for manufacturing the same Grant 9,059,187 - Furutani , et al. June 16, 2	2015-06-16
Wiring board and method for manufacturing the same Grant 9,035,463 - Shizuno , et al. May 19, 2	2015-05-19
Substrate For Mounting Semiconductor, Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140284820 - FURUTANI; Toshiki ; et al.	2014-09-25
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device Grant 8,785,255 - Furutani , et al. July 22, 2	2014-07-22
Substrate For Mounting Semiconductor, Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140162411 - FURUTANI; Toshiki ; et al.	2014-06-12
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device Grant 8,698,303 - Furutani , et al. April 15, 2	2014-04-15
Wiring Board And Method For Manufacturing The Same App 20130307162 - Shizuno; Yoshinori ; et al.	2013-11-21
Wiring board Grant 8,546,922 - Furutani , et al. October 1, 2	2013-10-01
Substrate For Mounting Semiconductor, Semiconductor Device And Method For Manufacturing Semiconductor Device App 20120181708 - FURUTANI; Toshiki ; et al.	2012-07-19
Wiring Board App 20120175754 - FURUTANI; Toshiki ; et al.	2012-07-12
Electronic Component And Method For Manufacturing The Same App 20120080786 - FURUTANI; Toshiki ; et al.	2012-04-05
Bone-joining articles Grant 5,275,602 - Shimizu , et al. January 4, 1	1994-01-04
Process for preparation of dried collagen sponge Grant 5,116,552 - Morita , et al. May 26, 1	1992-05-26

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