Takahashi; Naotomi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takahashi; Naotomi.The latest application filed is for "laminate for forming capacitor layer and method for manufacturing the same".

Company Profile

0.11.16

Takahashi; Naotomi - Ageo JP
Takahashi, Naotomi - Ageo-shi Saitama JP
Takahashi, Naotomi - Saitama JP
Takahashi, Naotomi - Ageo-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same Grant 6,902,824 - Yamamoto , et al. June 7, 2	2005-06-07
Laminate for forming capacitor layer and method for manufacturing the same Grant 6,839,219 - Mashiko , et al. January 4, 2	2005-01-04
Manufacturing process for printed wiring board Grant 6,716,572 - Yamamoto , et al. April 6, 2	2004-04-06
Laminate for forming capacitor layer and method for manufacturing the same App 20040053020 - Mashiko, Yasuaki ; et al.	2004-03-18
Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit Grant 6,660,406 - Yamamoto , et al. December 9, 2	2003-12-09
Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil Grant 6,649,274 - Taenaka , et al. November 18, 2	2003-11-18
Filtration method of copper electrolyte Grant 6,616,827 - Nabekura , et al. September 9, 2	2003-09-09
Blade for cutting copper foil App 20030150308 - Fujita, Satoru ; et al.	2003-08-14
Surface-treated copper foil and method for producing the same Grant 6,605,369 - Takahashi , et al. August 12, 2	2003-08-12
Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate App 20030148136 - Yamamoto, Takuya ; et al.	2003-08-07
Copper foil for printed wiring board Grant 6,544,664 - Takahashi , et al. April 8, 2	2003-04-08
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil Grant 6,479,170 - Takahashi , et al. November 12, 2	2002-11-12
Method for winding copper foil on core tube Grant 6,478,247 - Fujiwara , et al. November 12, 2	2002-11-12
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same App 20020079133 - Yamamoto, Takuya ; et al.	2002-06-27
Manufacturing process for printed wiring board App 20020081530 - Yamamoto, Takuya ; et al.	2002-06-27
Cathode electrode material and rotating cathode drum for electrolytic copper foil production using the same App 20020064019 - Dobashi, Makoto ; et al.	2002-05-30
Method for winding copper foil on core tube App 20020027179 - Fujiwara, Kazuhisa ; et al.	2002-03-07
Manufacturing method of electrodeposited copper foil and electrodeposited copper foil App 20020015833 - Takahashi, Naotomi ; et al.	2002-02-07
Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board App 20020004124 - Hirasawa, Yutaka ; et al.	2002-01-10
Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit App 20020004123 - Yamamoto, Takuya ; et al.	2002-01-10
Filtration method of copper electrolyte App 20010042688 - Nabekura, Kazuyoshi ; et al.	2001-11-22
Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil App 20010014406 - Mitsuhashi, Masakazu ; et al.	2001-08-16
Surface-treated copper foil, method of producing the surface-treated copper foil, and cooper-clad laminate employing the surface-treated copper foil App 20010014410 - Mitsuhashi, Masakazu ; et al.	2001-08-16
Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil App 20010014408 - Mitsuhashi, Masakazu ; et al.	2001-08-16
Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil App 20010014407 - Mitsuhashi, Masakazu ; et al.	2001-08-16
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper - clad laminate employing the electrodeposited copper foil App 20010008091 - Takahashi, Naotomi ; et al.	2001-07-19
Process for surface treatment of copper product Grant 4,640,747 - Ueno , et al. February 3, 1	1987-02-03

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