Takahama; Shinobu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takahama; Shinobu.The latest application filed is for "method of fabricating power semiconductor device and lead frame".
- Takahama; Shinobu - Tokyo JP
- Takahama; Shinobu - Fukuoka JP
- Takahama; Shinobu - N/A
- Takahama; Shinobu - Itami JP
| Patent | Date |
|---|---|
| Method of fabricating power semiconductor device and lead frame Grant 5,792,676 - Masumoto , et al. August 11, 1 | 1998-08-11 |
| Semiconductor device having electrodes embedded in an insulating case Grant 5,646,445 - Masumoto , et al. July 8, 1 | 1997-07-08 |
| Semiconductor device, resin for sealing same and method of fabricating same Grant 5,430,330 - Takahama , et al. July 4, 1 | 1995-07-04 |
| Semiconductor device Grant 5,038,194 - Takahama August 6, 1 | 1991-08-06 |
| Method of manufacturing package for high power integrated circuit Grant 4,677,741 - Takahama July 7, 1 | 1987-07-07 |
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