Takahagi; Takayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takahagi; Takayuki.The latest application filed is for "low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same".

Company Profile

0.5.8

Takahagi; Takayuki - Higashi-Hiroshima JP
Takahagi; Takayuki - Higashi-Hiroshima city JP
Takahagi; Takayuki - Hiroshima JP
Takahagi; Takayuki - Aki-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same Grant 8,158,536 - Sakurai , et al. April 17, 2	2012-04-17
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same App 20100237476 - Sakurai; Toshio ; et al.	2010-09-23
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same Grant 7,749,920 - Sakurai , et al. July 6, 2	2010-07-06
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components App 20090283013 - Takahagi; Takayuki ; et al.	2009-11-19
Semiconductor device fabrication method and fabrication apparatus Grant 7,371,694 - Sasaki , et al. May 13, 2	2008-05-13
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components App 20070107317 - Takahagi; Takayuki ; et al.	2007-05-17
Low-dielectric films, and manufacturion method thereof, and electronic component using it App 20060244034 - Sakurai; Toshio ; et al.	2006-11-02
Method of producing multilayer interconnection structure Grant 7,022,598 - Shingubara , et al. April 4, 2	2006-04-04
Semiconductor device fabrication method and fabrication apparatus App 20050186804 - Sasaki, Ken ; et al.	2005-08-25
Electroless plating process, and embedded wire and forming process thereof Grant 6,852,624 - Shingubara , et al. February 8, 2	2005-02-08
Method of producing multilayer interconnection structure App 20050009334 - Shingubara, Shoso ; et al.	2005-01-13
Method of manufacturing multilevel interconnection App 20040213895 - Shingubara, Shoso ; et al.	2004-10-28
Electroless plating process, and embedded wire and forming process thereof App 20030068887 - Shingubara, Shoso ; et al.	2003-04-10

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