TAKAGAKI; Tatsuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAKAGAKI; Tatsuro.The latest application filed is for "assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing same".

Company Profile

11.16.21

TAKAGAKI; Tatsuro - NAGOYA-CITY JP
Takagaki; Tatsuro - Nagoya JP
Takagaki; Tatsuro - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Assembly Of Piezoelectric Material Substrate And Supporting Substrate, And Method For Manufacturing Same App 20210265558 - HORI; Yuji ; et al.	2021-08-26
Joined body of piezoelectric material substrate and support substrate Grant 11,082,025 - Hori , et al. August 3, 2	2021-08-03
Joined body of piezoelectric material substrate and support substrate Grant 11,082,026 - Hori , et al. August 3, 2	2021-08-03
Method for producing connection substrate Grant 11,013,127 - Takagaki , et al. May 18, 2	2021-05-18
Joined Body Of Piezoelectric Material Substrate And Support Substrate App 20210067129 - HORI; Yuji ; et al.	2021-03-04
Joined Body Of Piezoelectric Material Substrate And Support Substrate App 20210067130 - HORI; Yuji ; et al.	2021-03-04
Assembly Of Piezoelectric Material Substrate And Supporting Substrate, And Method For Manufacturing Same App 20200350485 - HORI; Yuji ; et al.	2020-11-05
Assembly Of Piezoelectric Material Substrate And Support Substrate, And Method For Manufacturing Said Assembly App 20200313640 - HORI; Yuji ; et al.	2020-10-01
Joined Body Of Piezoelectric Material Substrate And Support Substrate, And Acoustic Wave Element App 20200313643 - HORI; Yuji ; et al.	2020-10-01
Assembly Of Piezoelectric Material Substrate And Support Substrate, And Method For Manufacturing Said Assembly App 20200227623 - HORI; Yuji ; et al.	2020-07-16
Connection substrate Grant 10,278,286 - Ide , et al.	2019-04-30
Connection substrate Grant 10,257,941 - Miyazawa , et al.	2019-04-09
Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductor Grant 10,204,838 - Ide , et al. Feb	2019-02-12
Connection Substrate App 20190014663 - IDE; Akiyoshi ; et al.	2019-01-10
Connection Substrate App 20180359866 - MIYAZAWA; Sugio ; et al.	2018-12-13
Method For Producing Connection Substrate App 20180359865 - TAKAGAKI; Tatsuro ; et al.	2018-12-13
Insulating substrates including through holes Grant 9,894,763 - Takagaki , et al. February 13, 2	2018-02-13
Composite substrate, semiconductor device, and method for manufacturing semiconductor device Grant 9,812,345 - Ide , et al. November 7, 2	2017-11-07
Handle substrates of composite substrates for semiconductors, and composite substrates for semiconductors Grant 9,673,282 - Miyazawa , et al. June 6, 2	2017-06-06
Silicon wafer with a plurality of chip patterns Grant 9,559,090 - Takagaki January 31, 2	2017-01-31
Insulating substrates including through holes Grant 9,538,653 - Takagaki , et al. January 3, 2	2017-01-03
Piezoelectric element Grant 9,530,954 - Takagaki , et al. December 27, 2	2016-12-27
Handle Substrate of Composite Substrate for Semiconductor, and Composite Substrate for Semiconductor App 20160358828 - Ide; Akiyoshi ; et al.	2016-12-08
Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the same Grant 9,425,083 - Miyazawa , et al. August 23, 2	2016-08-23
Handle substrate and composite wafer for semiconductor device Grant 9,390,955 - Takagaki , et al. July 12, 2	2016-07-12
Handle Substrates for Composite Substrates for Semiconductors App 20160046528 - Miyazawa; Sugio ; et al.	2016-02-18
Insulating Substrates Including Through Holes App 20160007461 - Takagaki; Tatsuro ; et al.	2016-01-07
Handle Substrate, Composite Substrate for Semiconductor, and Semiconductor Circuit Board and Method for Manufacturing the Same App 20160005643 - Miyazawa; Sugio ; et al.	2016-01-07
Composite Substrate, Semiconductor Device, And Method For Manufacturing Semiconductor Device App 20150380290 - Ide; Akiyoshi ; et al.	2015-12-31
Handle Substrates of Composite Substrates for Semiconductors, and Composite Substrates for Semiconductors App 20150364548 - Miyazawa; Sugio ; et al.	2015-12-17
Insulating Substrates Including Through Holes App 20150353428 - Takagaki; Tatsuro ; et al.	2015-12-10
Handle Substrate and Composite Wafer for Semiconductor Device App 20150357221 - Takagaki; Tatsuro ; et al.	2015-12-10
Pattern Arrangement Method, Silicon Wafer And Semiconductor Device Using A Silicon Wafer With A Pattern Arrangement App 20150228637 - Takagaki; Tatsuro	2015-08-13
Semiconductor device using a silicon wafer with a pattern arrangement Grant 9,046,545 - Takagaki June 2, 2	2015-06-02
Piezoelectric Element App 20140139076 - TAKAGAKI; Tatsuro ; et al.	2014-05-22
Pattern Arrangement Method, Silicon Wafer And Semiconductor Device App 20110140214 - Takagaki; Tatsuro	2011-06-16

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