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Patent applications and USPTO patent grants for Takagahara; Kaoru.The latest application filed is for "photosensitive resin composition and photosensitive films and laminates made by using the same".
Patent | Date |
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Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor Grant 7,189,488 - Yamanaka , et al. March 13, 2 | 2007-03-13 |
Photosensitive resin composition and photosensitive films and laminates made by using the same Grant 7,141,614 - Okada , et al. November 28, 2 | 2006-11-28 |
Photosensitive resin composition and photosensitive films and laminates made by using the same App 20040265731 - Okada, Koji ;   et al. | 2004-12-30 |
Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom App 20040235992 - Okada, Koji ;   et al. | 2004-11-25 |
Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board App 20040048978 - Okada, Koji ;   et al. | 2004-03-11 |
Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor App 20030149142 - Yamanaka, Toshio ;   et al. | 2003-08-07 |
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